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用于高功率和高频操作的具有各种介电钝化结构的AlGaN/GaN高电子迁移率晶体管的工作特性:一项模拟研究。

Operational Characteristics of AlGaN/GaN High-Electron-Mobility Transistors with Various Dielectric Passivation Structures for High-Power and High-Frequency Operations: A Simulation Study.

作者信息

Kim Ji-Hun, Lim Chae-Yun, Lee Jae-Hun, Choi Jun-Hyeok, Min Byoung-Gue, Kang Dong Min, Kim Hyun-Seok

机构信息

Division of Electronics and Electrical Engineering, Dongguk University-Seoul, Seoul 04620, Republic of Korea.

Electronics and Telecommunications Research Institute, Daejeon 34129, Republic of Korea.

出版信息

Micromachines (Basel). 2024 Sep 3;15(9):1126. doi: 10.3390/mi15091126.

Abstract

This study investigates the operational characteristics of AlGaN/GaN high-electron-mobility transistors (HEMTs) by employing various passivation materials with different dielectric constants and passivation structures. To ensure the simulation reliability, the parameters were calibrated based on the measured data from the fabricated basic SiN passivation structure of the HEMT. The SiN passivation material was replaced with high-k materials, such as AlO and HfO, to improve the breakdown voltage. The AlO and HfO passivation structures achieved breakdown voltage improvements of 6.62% and 17.45%, respectively, compared to the basic SiN passivation structure. However, the increased parasitic capacitances reduced the cut-off frequency. To mitigate this reduction, the operational characteristics of hybrid and partial passivation structures were analyzed. Compared with the HfO passivation structure, the HfO partial passivation structure exhibited a 7.6% reduction in breakdown voltage but a substantial 82.76% increase in cut-off frequency. In addition, the HfO partial passivation structure exhibited the highest Johnson's figure of merit. Consequently, considering the trade-off relationship between breakdown voltage and frequency characteristics, the HfO partial passivation structure emerged as a promising candidate for high-power and high-frequency AlGaN/GaN HEMT applications.

摘要

本研究通过采用具有不同介电常数的各种钝化材料和钝化结构,研究了AlGaN/GaN高电子迁移率晶体管(HEMT)的工作特性。为确保模拟可靠性,基于从制造的HEMT基本SiN钝化结构的测量数据对参数进行了校准。将SiN钝化材料替换为高k材料,如AlO和HfO,以提高击穿电压。与基本SiN钝化结构相比,AlO和HfO钝化结构的击穿电压分别提高了6.62%和17.45%。然而,寄生电容的增加降低了截止频率。为减轻这种降低,分析了混合和部分钝化结构的工作特性。与HfO钝化结构相比,HfO部分钝化结构的击穿电压降低了7.6%,但截止频率大幅提高了82.76%。此外,HfO部分钝化结构表现出最高的约翰逊优值。因此,考虑到击穿电压和频率特性之间的权衡关系,HfO部分钝化结构成为高功率和高频AlGaN/GaN HEMT应用的有前途的候选者。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7d6b/11433763/28895bf4c092/micromachines-15-01126-g001.jpg

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