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用于微机电系统应用的陶瓷：综述

Ceramics for Microelectromechanical Systems Applications: A Review.

作者信息

Fallah Nia Ehsan, Kouki Ammar

机构信息

Department of Electrical Engineering, École de Technologie Supérieure (ÉTS), Montreal, QC H3C 1K3, Canada.

出版信息

Micromachines (Basel). 2024 Oct 9;15(10):1244. doi: 10.3390/mi15101244.

DOI:10.3390/mi15101244
PMID:39459118
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11509724/
Abstract

A comprehensive review of the application of different ceramics for MEMS devices is presented. Main ceramics materials used for MEMS systems and devices including alumina, zirconia, aluminum Nitride, Silicon Nitride, and LTCC are introduced. Conventional and new methods of fabricating each material are explained based on the literature, along with the advantages of the new approaches, mainly additive manufacturing, i.e., 3D-printing technologies. Various manufacturing processes with relevant sub-techniques are detailed and the ones that are more suitable to have an application for MEMS devices are highlighted with their properties. In the main body of this paper, each material with its application for MEMS is categorized and explained. The majority of works are within three main classifications, including the following: (i) using ceramics as a substrate for MEMS devices to be mounted or fabricated on top of it; (ii) ceramics are a part of the materials used for an MEMS device or a monolithic fabrication of MEMS and ceramics; and finally, (iii) using ceramics as packaging solution for MEMS devices. We elaborate on how ceramics may be superior substitutes over other materials when delicate MEMS-based systems need to be assembled or packaged by a simpler fabrication process as well as their advantages when they need to operate in harsh environments.

摘要

本文对不同陶瓷材料在微机电系统（MEMS）器件中的应用进行了全面综述。介绍了用于MEMS系统和器件的主要陶瓷材料，包括氧化铝、氧化锆、氮化铝、氮化硅和低温共烧陶瓷（LTCC）。基于文献解释了每种材料的传统制造方法和新方法，以及新方法（主要是增材制造，即3D打印技术）的优点。详细介绍了各种制造工艺及其相关子技术，并突出了更适合用于MEMS器件的工艺及其特性。在本文主体部分，对每种用于MEMS的材料及其应用进行了分类和解释。大多数研究工作主要分为三大类，包括：（i）使用陶瓷作为MEMS器件的衬底，以便在其上安装或制造器件；（ii）陶瓷是用于MEMS器件的材料的一部分，或者是MEMS与陶瓷的单片制造；最后，（iii）使用陶瓷作为MEMS器件的封装解决方案。我们详细阐述了在需要通过更简单的制造工艺组装或封装基于MEMS的精密系统时，陶瓷相对于其他材料可能具有的优势，以及它们在恶劣环境中运行时的优点。

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