Cao Yicheng, Luo Wei, Zhang Wenjing, Xie Haofeng, Yang Zhen, Li Zengde, Peng Lijun, Zhu Yunqing
State Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 100088, China.
GRIMAT Engineering Institute Co., Ltd., Beijing 101407, China.
Materials (Basel). 2024 Nov 20;17(22):5658. doi: 10.3390/ma17225658.
Discontinuous precipitation-strengthened Cu-Ni-Si alloys are highly regarded for their combination of high strength and excellent electrical conductivity. However, the slow process of discontinuous precipitation, typically requiring up to 24 h for complete formation, significantly increases the alloy's production costs and limits potential improvements in its properties. This study addresses this issue by applying pre-deformation to Cu-6Ni-1.42Si alloys, which accelerated the discontinuous precipitation (DP) of NiSi by approximately 48 times, resulting in the formation of fast DP and full DP alloys. The fast DP alloy exhibited a smaller DP size and inter-distance than the full DP alloy, achieving a tensile strength of 1070 MPa and a conductivity of 38.5% IACS. In contrast, the full DP alloy had a slightly lower tensile strength (approximately 930 MPa) but a higher conductivity of 46% IACS. Both alloys outperform traditional Cu-Ni-Si alloys in strength while maintaining comparable conductivity. The accelerated DP technique improves mechanical properties without significantly sacrificing conductivity, offering a new approach for high-performance conductive materials.
不连续析出强化的铜镍硅合金因其高强度与优异导电性的结合而备受关注。然而，不连续析出过程缓慢，通常需要长达24小时才能完全形成，这显著增加了合金的生产成本，并限制了其性能的潜在提升。本研究通过对Cu-6Ni-1.42Si合金进行预变形来解决这一问题，该预变形使NiSi的不连续析出（DP）加速了约48倍，从而形成了快速DP合金和完全DP合金。快速DP合金的DP尺寸和间距比完全DP合金小，其抗拉强度达到1070MPa，电导率为38.5%IACS。相比之下，完全DP合金的抗拉强度略低（约930MPa），但电导率更高，为46%IACS。两种合金在强度方面均优于传统铜镍硅合金，同时保持了相当的导电性。加速DP技术在不显著牺牲导电性的情况下改善了机械性能，为高性能导电材料提供了一种新方法。
