Millisecond-level transient heating and temperature monitoring technique for ultrasound-induced thermal strain imaging.

Ultrasound-induced thermal strain imaging (US-TSI) is a promising ultrasound imaging modality that has been demonstrated in preclinical studies to identify a lipid-rich necrotic core of an atherosclerotic plaque. However, human physiological motion, e.g., cardiac pulsation, poses challenges in implementing US-TSI applications, where achieving a millisecond-level temperature rise by delivering acoustic energy from a compact US-TSI probe is a key requirement. This study aims to develop a transient ultrasound heating and thermocouple monitoring technique at the millisecond level for US-TSI applications. We designed, prototyped, and characterized a novel US-TSI probe that includes a high-power, 3.5 MHz heating transducer with symmetrical dual 1D concave array. Additionally, millisecond-level temperature monitoring was demonstrated with fast-response thermocouples in laser- and ultrasound- induced thermal tests. Subsequently, we demonstrated the prototyped US-TSI probe can produce a desired temperature rise in a millisecond-short time window phantom and animal tests. The prototyped US-TSI probe delivered zero-to-peak acoustic pressure up to 6.2 MPa with a 90 V input voltage. Both laser- and ultrasound- induced thermal tests verified that the selected thermocouples can monitor temperature change within 50 ms. The fast-response thermocouple confirmed the transient heating ability of the US-TSI probe, achieving a 3.9 °C temperature rise after a 25 ms heating duration (50% duty cycle) in the gel phantom and a 2.0 °C temperature rise after a 50 ms heating duration (50% duty cycle) in a pig model. We successfully demonstrated a millisecond-level transient heating and temperature monitoring technique utilizing the novel US-TSI probe and fast-response thermocouples. The reported transient ultrasound heating and thermocouple monitoring technique is promising for future human subject studies in US-TSI or other ultrasound-related thermal investigations.