Takano Shunsuke, Takahashi Rena, Tabata Tomoko, Zeng Chen, Ikeda Masaomi, Shimada Yasushi
Department of Cariology and Operative Dentistry, Graduate School of Medical and Dental Sciences, Institute of Science Tokyo, 1-5-45 Yushima, Bunkyo-Ku, Tokyo, 113-8549, Japan.
Department of Oral Biomedical Engineering, Graduate School of Medical and Dental Sciences, Institute of Science Tokyo, 1-5-45 Yushima, Bunkyo-Ku, Tokyo, 113-8549, Japan.
BMC Oral Health. 2025 Jan 20;25(1):101. doi: 10.1186/s12903-025-05438-z.
Resin cements often require substrate-specific pretreatment. Recently, universal adhesive systems have been introduced, simplifying procedures by eliminating the need for multiple adhesives and offering options that do not require light curing. This study investigated the bonding performance of universal adhesive systems combined with dual-polymerising resin cements on enamel, dentin, zirconia, lithium disilicate ceramics (LDS), and resin blocks.
Two universal adhesive and dual-polymerising resin cement combinations from the same manufacturer were tested: Bondmer Lightless II (BLII) with Estecem II (ECII), and Scotchbond Universal Plus adhesive (SBU) with RelyX Universal resin cement (RXU). Enamel, dentin, zirconia (Katana Zirconia UTML), LDS (IPS e.max CAD CEREC), and resin blocks (Katana Avencia P Block) were used as substrates. The universal adhesive was applied to all bonding surfaces, followed by resin cement application in micro-bore Tygon tubes and light curing for 40 s. Micro-shear bond strength (μSBS) was measured after 0 thermal cycles (0TC) or 10,000 thermal cycles (10kTC) (n = 20). Statistical analyses were conducted using t-tests and Welch's t-tests with Bonferroni correction (α = 0.05), and failure modes were examined.
In the BLII/ECII group, the mean μSBS values exceeded 15 MPa for all substrates at 0TC. After thermocycling, μSBS increased significantly for the enamel (p < 0.05), remained unchanged for dentin and zirconia (p > 0.05) and decreased for LDS and resin blocks (p < 0.05). In the SBU/RXU group, 0TC μSBS values exceeded 15 MPa for enamel, zirconia, and resin blocks, but thermocycling significantly decreased μSBS for all substrates (p < 0.05). Comparison between BLII/ECII and SBU/RXU group showed no significant differences for enamel and resin blocks at 0TC (p > 0.05), but the BLII/ECII group exhibited higher SBS in the other groups (p < 0.05). Adhesive failure was the most frequently observed failure type across all groups.
The adhesive performance on diverse dental substrates including enamel, dentin, zirconia, LDS, and resin blocks was notably affected by the selection of universal adhesive systems in combination with dual-polymerising resin cements that were applied. The BLII/ECII combination demonstrated long-term stable bonding performance for enamel, dentin, and zirconia.
树脂水门汀通常需要特定底物的预处理。最近，通用型粘结系统已被引入，通过无需多种粘结剂简化了操作程序，并提供了无需光固化的选择。本研究调查了通用型粘结系统与双固化树脂水门汀联合应用于牙釉质、牙本质、氧化锆、二硅酸锂陶瓷（LDS）和树脂块上的粘结性能。
测试了来自同一制造商的两种通用型粘结剂和双固化树脂水门汀组合：Bondmer Lightless II（BLII）与Estecem II（ECII），以及Scotchbond Universal Plus粘结剂（SBU）与RelyX Universal树脂水门汀（RXU）。使用牙釉质、牙本质、氧化锆（Katana Zirconia UTML）、LDS（IPS e.max CAD CEREC）和树脂块（Katana Avencia P Block）作为底物。将通用型粘结剂应用于所有粘结表面，随后在微型泰科管中应用树脂水门汀并光固化40秒。在0次热循环（0TC）或10000次热循环（10kTC）后测量微剪切粘结强度（μSBS）（n = 20）。使用t检验和经Bonferroni校正的Welch t检验进行统计分析（α = 0.05），并检查失效模式。
在BLII/ECII组中，所有底物在0TC时的平均μSBS值均超过15MPa。热循环后，牙釉质的μSBS显著增加（p < 0.05），牙本质和氧化锆的μSBS保持不变（p > 0.05），而LDS和树脂块的μSBS降低（p < 0.05）。在SBU/RXU组中，牙釉质、氧化锆和树脂块的0TC μSBS值超过15MPa，但热循环使所有底物的μSBS显著降低（p < 0.05）。BLII/ECII组与SBU/RXU组在0TC时牙釉质和树脂块的比较无显著差异（p > 0.05），但BLII/ECII组在其他组中表现出更高的SBS（p < 0.05）。粘结失败是所有组中最常观察到的失败类型。
通用型粘结系统与所应用的双固化树脂水门汀的组合选择对包括牙釉质、牙本质、氧化锆、LDS和树脂块在内的多种牙科底物的粘结性能有显著影响。BLII/ECII组合对牙釉质、牙本质和氧化锆表现出长期稳定的粘结性能。
