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堆叠纳米片全栅环绕型同素异形相界场效应晶体管

Stacked Nanosheet Gate-All-Around Morphotropic Phase Boundary Field-Effect Transistors.

作者信息

Kim Sihyun, Kim Hyun-Min, Kwon Ki-Ryun, Kwon Daewoong

机构信息

Department of Electronic Engineering, Sogang University, Seoul, 04107, Republic of Korea.

Department of Electrical Engineering, Hanyang University, Seoul, 04763, Republic of Korea.

出版信息

Adv Sci (Weinh). 2025 May;12(18):e2413090. doi: 10.1002/advs.202413090. Epub 2025 Mar 17.

Abstract

A material design method is proposed using ferroelectric (FE)-antiferroelectric (AFE) mixed-phase HfZrO (HZO) to achieve performance improvements in morphotropic phase boundary (MPB) field-effect transistors (MPB-FETs), such as steep subthreshold swing (SS) and non-hysteretic on-current (I) enhancement. Capacitance (small-signal and quasi-static) and transient current measurements of MPB-FETs confirmed that near-threshold voltage (V) capacitance amplification leads to I boosts under high-speed and low-power conditions. For the first time, two-stacked nanosheet (NS) gate-all-around (GAA) MPB-FETs with optimized HZO, demonstrating superior short channel effect (SCE) immunity with enhanced current drivability is fabricated. Bias temperature instability (BTI) analyses revealed over-10-year endurance at 0.6 V and 120 °C. The NS MPB-FETs achieved a 24.1% I gain, 82.5 mV operating voltage scalability, and a 30.7% AC performance improvement at V = 0.6 V compared to control MOSFETs with HfO high-k dielectric. Transconductance benchmarks with industrial logic technologies confirmed that the MPB with mixed HZO enables effective oxide thickness scaling without mobility degradation, making NS MPB-FETs an ideal choice for low-power / high-performance CMOS technology.

摘要

提出了一种使用铁电(FE)-反铁电(AFE)混合相铪锆氧化物(HZO)的材料设计方法,以实现同型相界(MPB)场效应晶体管(MPB-FET)性能的提升,如陡峭的亚阈值摆幅(SS)和非滞后导通电流(I)增强。MPB-FET的电容(小信号和准静态)及瞬态电流测量结果证实,近阈值电压(V)电容放大在高速和低功耗条件下会导致I提升。首次制造出了具有优化HZO的双层纳米片(NS)全栅(GAA)MPB-FET,其展现出卓越的短沟道效应(SCE)抗扰性以及增强的电流驱动能力。偏置温度不稳定性(BTI)分析表明,在0.6 V和120°C条件下具有超过10年的耐久性。与采用HfO高k电介质的对照MOSFET相比,NS MPB-FET在V = 0.6 V时实现了24.1%的I增益、82.5 mV的工作电压可扩展性以及30.7%的交流性能提升。与工业逻辑技术的跨导基准测试证实,混合HZO的MPB能够在不降低迁移率的情况下实现有效的氧化物厚度缩放,使NS MPB-FET成为低功耗/高性能CMOS技术的理想选择。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/cbff/12079460/8c9048f6d746/ADVS-12-2413090-g001.jpg

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