Chen Guoliang, Wang Guiqi, Wang Zhenzhen, Wang Lijun
Hangzhou Institute of Technology, Xidian University, Hangzhou 311231, China.
Micromachines (Basel). 2025 Apr 2;16(4):431. doi: 10.3390/mi16040431.
With the growing demand for high-performance computing (HPC), artificial intelligence (AI), and data communication and storage, new chip technologies have emerged, following Moore's Law, over the past few decades. As we enter the post-Moore era, transistor dimensions are approaching their physical limits. Advanced packaging technologies, such as 3D chiplets hetero-integration and co-packaged optics (CPO), have become crucial for further improving system performance. Currently, most solutions rely on silicon-based technologies, which alleviate some challenges but still face issues such as warpage, bumps' reliability, through-silicon vias' (TSVs) and redistribution layers' (RDLs) reliability, and thermal dissipation, etc. Glass, with its superior mechanical, thermal, electrical, and optical properties, is emerging as a promising material to address these challenges, particularly with the development of femtosecond laser technology. This paper discusses the evolution of both conventional and advanced packaging technologies and outlines future directions for design, fabrication, and packaging using glass substrates and femtosecond laser processing.
随着对高性能计算（HPC）、人工智能（AI）以及数据通信和存储的需求不断增长，在过去几十年里，遵循摩尔定律，新的芯片技术不断涌现。当我们进入后摩尔时代，晶体管尺寸正接近其物理极限。先进封装技术，如3D小芯片异质集成和共封装光学（CPO），对于进一步提升系统性能变得至关重要。目前，大多数解决方案依赖基于硅的技术，这些技术缓解了一些挑战，但仍面临诸如翘曲、凸块可靠性、硅通孔（TSV）和再分布层（RDL）可靠性以及散热等问题。玻璃凭借其卓越的机械、热、电和光学性能，正成为应对这些挑战的一种有前景的材料，特别是随着飞秒激光技术的发展。本文讨论了传统和先进封装技术的演变，并概述了使用玻璃基板和飞秒激光加工进行设计、制造和封装的未来方向。
