Dai Wen, Wang Yandong, Li Maohua, Chen Lu, Yan Qingwei, Yu Jinhong, Jiang Nan, Lin Cheng-Te
Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201, P. R. China.
Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China.
Adv Mater. 2024 Sep;36(37):e2311335. doi: 10.1002/adma.202311335. Epub 2024 Jun 26.
The challenges associated with heat dissipation in high-power electronic devices used in communication, new energy, and aerospace equipment have spurred an urgent need for high-performance thermal interface materials (TIMs) to establish efficient heat transfer pathways from the heater (chip) to heat sinks. Recently, emerging 2D materials, such as graphene and boron nitride, renowned for their ultrahigh basal-plane thermal conductivity and the capacity to facilitate cross-scale, multi-morphic structural design, have found widespread use as thermal fillers in the production of high-performance TIMs. To deepen the understanding of 2D material-based TIMs, this review focuses primarily on graphene and boron nitride-based TIMs, exploring their structures, properties, and applications. Building on this foundation, the developmental history of these TIMs is emphasized and a detailed analysis of critical challenges and potential solutions is provided. Additionally, the preparation and application of some other novel 2D materials-based TIMs are briefly introduced, aiming to offer constructive guidance for the future development of high-performance TIMs.
通信、新能源和航空航天设备中使用的高功率电子设备所面临的散热挑战，促使人们迫切需要高性能热界面材料（TIM），以建立从发热器（芯片）到散热器的高效传热路径。最近，以其超高的基面热导率和促进跨尺度、多形态结构设计能力而闻名的新兴二维材料，如石墨烯和氮化硼，已广泛用作高性能TIM生产中的热填料。为了加深对二维材料基TIM的理解，本综述主要关注基于石墨烯和氮化硼的TIM，探讨它们的结构、性能和应用。在此基础上，强调了这些TIM的发展历程，并对关键挑战和潜在解决方案进行了详细分析。此外，还简要介绍了一些其他新型二维材料基TIM的制备和应用，旨在为高性能TIM的未来发展提供建设性指导。
