Vandervelde Joshua, Yoon Yeowon, Shahriar Rifat, Cronin Stephen B, Chen Yong
Center for Advanced Manufacturing University of Southern California Los Angeles CA 90007 USA.
Department of Aerospace and Mechanical Engineering University of Southern California Los Angeles CA 90089 USA.
Small Sci. 2025 Apr 2;5(6):2500022. doi: 10.1002/smsc.202500022. eCollection 2025 Jun.
Laser-induced graphene (LIG) is a novel multifunctional material fabricated from a single-step laser scribing process on a variety of polymers. LIG electronics display exceptional conducting, heating, and sensing properties, which are desirable for customizable circuits within 3D-printed structures. However, the properties of LIG on high-performance additive manufacturing (AM) materials, such as polyetherimide (PEI, trade name Ultem) and polyether ether ketone (PEEK), have not been thoroughly investigated. In this study, LIG is scribed by a blue laser on pure and 3D-printed PEI and PEEK. Remarkably, the LIG's electrical performances represent several of the lowest sheet resistances reported on PEI- and PEEK-derived LIG to date. These minimal values (1.02 Ω sq) and their high conductivities (45.4 S cm) are also among the best electrical characteristics studied on any LIG precursor. The versatility of LIG electronics for AM is further demonstrated on 3D-printed specimens with laser-scribed heaters and strain gauges. LIG heaters show impressive operating ranges and excellent electrothermal properties; LIG strain gauges exhibit large gauge factors and minimal drift. In these findings, an effective approach to fabricate facile electronics in AM structures by integrating additive and laser manufacturing processes is presented.
激光诱导石墨烯（LIG）是一种通过在多种聚合物上进行单步激光刻划工艺制备的新型多功能材料。LIG电子产品具有卓越的导电、加热和传感特性，这对于3D打印结构中的可定制电路来说是非常理想的。然而，LIG在高性能增材制造（AM）材料上的性能，如聚醚酰亚胺（PEI，商品名Ultem）和聚醚醚酮（PEEK），尚未得到充分研究。在本研究中，通过蓝色激光在纯的和3D打印的PEI和PEEK上刻划LIG。值得注意的是，LIG的电学性能代表了迄今为止在基于PEI和PEEK的LIG上报道的几个最低的表面电阻。这些最小值（1.02Ω/sq）及其高电导率（45.4 S/cm）也是在任何LIG前驱体上研究的最佳电学特性之一。LIG电子产品在具有激光刻划加热器和应变片的3D打印样品上进一步展示了其在增材制造方面的多功能性。LIG加热器显示出令人印象深刻的工作范围和优异的电热性能；LIG应变片表现出大的应变系数和最小的漂移。在这些研究结果中，提出了一种通过整合增材制造和激光制造工艺在AM结构中制造简易电子产品的有效方法。
