Bai Jindong, Yang Wenhang, Zhu Shouzheng, Jin Haijun, Zhang Yuchen, Jin Ke, Liu Xiaoshuai, Li Chunlai, Wang Jianyu, Qi Hongxing, Liu Shijie
Hangzhou Institute for Advanced Study, University of Chinese Academy of Sciences, Hangzhou, China.
JiYuan (Hangzhou) Technology Co., Ltd, Hangzhou, China.
Commun Eng. 2025 Jul 8;4(1):119. doi: 10.1038/s44172-025-00456-9.
In applications such as those in the semiconductor industry, precise temperature measurements with low power consumption are crucial. This article presents a novel noncontact temperature measurement method with low power consumption and high precision, and a thermopile sensor-based linear array for surface temperature measurements is used in semiconductor manufacturing and temperature calibration applications. The array consists of 15 thermopile sensors, a negative temperature coefficient (NTC) thermistor, an FPGA control board with a fiber optic interface, and a motion module. Moreover, the total power consumption of the board is less than 1.5 W. On the FPGA control board, a multiparameter temperature compensation algorithm is used to address intrinsic temperature differences and consistency errors among the sensors. Compared with the traditional two-point calibration method, the temperature measurement accuracy of the proposed method reaches 26 mK in the temperature range of 293-303 K, the maximum repeatability error of the sensor is less than 5.5 mK, and the non-uniformity error between 15 sensors is less than 11.9 mK. The array and its replicas were subjected to more than 6 h of rigorous testing, demonstrating their high stability, with the reduction in accuracy not exceeding 1.5 mK.
在诸如半导体行业的应用中，进行低功耗的精确温度测量至关重要。本文提出了一种新型的低功耗高精度非接触式温度测量方法，并且一种基于热电堆传感器的线性阵列用于半导体制造和温度校准应用中的表面温度测量。该阵列由15个热电堆传感器、一个负温度系数（NTC）热敏电阻、一个带有光纤接口的FPGA控制板以及一个运动模块组成。此外，该板的总功耗小于1.5W。在FPGA控制板上，采用多参数温度补偿算法来解决传感器之间的固有温度差异和一致性误差。与传统的两点校准方法相比，该方法在293 - 303K温度范围内的温度测量精度达到26mK，传感器的最大重复性误差小于5.5mK，15个传感器之间的不均匀性误差小于11.9mK。该阵列及其复制品经过了超过6小时的严格测试，证明了它们具有高稳定性，精度降低不超过1.5mK。
