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用于OLED的薄膜封装及其进展：迈向工程化

Thin-Film Encapsulation for OLEDs and Its Advances: Toward Engineering.

作者信息

Li Songju, Lan Linfeng, Li Min, Gao Zhuo, Yan Xiaolin, Fu Dong, Sun Xianwen

机构信息

State Key Laboratory of Luminescent Materials and Devices, Institute of Polymer Optoelectronic Materials and Devices, South China University of Technology, Guangzhou 510640, China.

Guangdong Juhua Printed Display Technology Co., Ltd., Guangzhou 510700, China.

出版信息

Materials (Basel). 2025 Jul 4;18(13):3175. doi: 10.3390/ma18133175.

DOI:10.3390/ma18133175
PMID:40649664
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC12251312/
Abstract

Thin-film encapsulation has been a critical method to realize small-size OLED displays. However, the manufacturing of large-size flexible OLED is still in the preparatory phase prior to commercialization, which entails more rigorous demands for reliability and flexibility with regard to thin-film encapsulation. This review, from the perspective of engineering for mass production, addresses the development of thin-film encapsulation and its three core properties for comprehensive validation while engineering, including basic properties, reliability, and compatibility. Moreover, considering the prospective evolution of display products, the review on novel thin-film encapsulation was conducted to evaluate the potential engineering value for thinning, ultra-flexibility, multifunctionality, novel equipment, and emerging technology. It is anticipated that some of the aforementioned technologies may prove to be of significant engineering value. It is therefore hoped that by comprehensive engineering verification, the commercial application of novel thin-film encapsulation can be promoted and the competitiveness of OLED products can be effectively enhanced.

摘要

薄膜封装一直是实现小尺寸OLED显示器的关键方法。然而，大尺寸柔性OLED的制造仍处于商业化之前的准备阶段，这对薄膜封装的可靠性和柔韧性提出了更严格的要求。本综述从大规模生产工程的角度出发，阐述了薄膜封装的发展及其在工程过程中进行全面验证的三个核心特性，包括基本特性、可靠性和兼容性。此外，考虑到显示产品的未来发展，对新型薄膜封装进行了综述，以评估其在减薄、超柔韧性、多功能性、新型设备和新兴技术方面的潜在工程价值。预计上述一些技术可能具有重大的工程价值。因此，希望通过全面的工程验证，能够推动新型薄膜封装的商业应用，并有效提升OLED产品的竞争力。

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