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基于CuO薄膜忆阻器的丝状电阻开关机制

Filamentary Resistive Switching Mechanism in CuO Thin Film-Based Memristor.

作者信息

Ozga Monika, Mroczynski Robert, Matus Krzysztof, Arabasz Sebastian, Witkowski Bartłomiej S

机构信息

Institute of Physics of the Polish Academy of Sciences, Al. Lotnikow 32/46, 02-668 Warsaw, Poland.

Warsaw University of Technology, Institute of Microelectronics and Optoelectronics, Koszykowa 75, 00-662 Warsaw, Poland.

出版信息

Materials (Basel). 2025 Aug 14;18(16):3820. doi: 10.3390/ma18163820.

DOI:10.3390/ma18163820
PMID:40870137
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC12387229/
Abstract

Understanding the resistive switching (RS) mechanisms in memristive devices is crucial for developing non-volatile memory technologies. Here, we investigate the memristor effect in hydrothermally grown Au-nanoseeded CuO films. Based on I-V measurements, conductive-AFM, S/TEM, and EDS analyses, we examine the changes within the switching layer associated with RS. Our results reveal a filamentary mechanism of RS. Notably, EDS mapping shows directional Au redistribution between the bottom nanoseeds and the top electrode, while Cu and O remain uniformly distributed. These findings support an electrochemical metallization (ECM)-like filamentary mechanism driven by Au species migration. The use of Au-nanoseeds, required by the solution-based growth method, critically affects filament formation and RS behavior. Our results emphasize the importance of microstructure and electrode-oxide interfaces in determining the switching mechanism in oxide-based memristors.

摘要

了解忆阻器件中的电阻开关(RS)机制对于开发非易失性存储技术至关重要。在此,我们研究了水热生长的金纳米籽晶CuO薄膜中的忆阻器效应。基于I-V测量、导电原子力显微镜、扫描/透射电子显微镜和能谱分析,我们研究了与电阻开关相关的开关层内的变化。我们的结果揭示了电阻开关的丝状机制。值得注意的是,能谱映射显示了底部纳米籽晶和顶部电极之间金的定向重新分布,而铜和氧保持均匀分布。这些发现支持了由金物种迁移驱动的类似电化学金属化(ECM)的丝状机制。基于溶液的生长方法所需的金纳米籽晶的使用,对细丝形成和电阻开关行为有至关重要的影响。我们的结果强调了微观结构和电极-氧化物界面在确定氧化物基忆阻器开关机制中的重要性。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/eca5/12387229/9134f16b2a1f/materials-18-03820-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/eca5/12387229/79b56108c62c/materials-18-03820-g0A1.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/eca5/12387229/63628e7d115b/materials-18-03820-g0A2.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/eca5/12387229/c1a9b09df787/materials-18-03820-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/eca5/12387229/2e6a0bb1db2c/materials-18-03820-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/eca5/12387229/5985d5819b0e/materials-18-03820-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/eca5/12387229/e369e5c35e8c/materials-18-03820-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/eca5/12387229/83470471b416/materials-18-03820-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/eca5/12387229/7bb01a775ec9/materials-18-03820-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/eca5/12387229/c7f589b82497/materials-18-03820-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/eca5/12387229/9134f16b2a1f/materials-18-03820-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/eca5/12387229/79b56108c62c/materials-18-03820-g0A1.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/eca5/12387229/63628e7d115b/materials-18-03820-g0A2.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/eca5/12387229/c1a9b09df787/materials-18-03820-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/eca5/12387229/2e6a0bb1db2c/materials-18-03820-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/eca5/12387229/5985d5819b0e/materials-18-03820-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/eca5/12387229/e369e5c35e8c/materials-18-03820-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/eca5/12387229/83470471b416/materials-18-03820-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/eca5/12387229/7bb01a775ec9/materials-18-03820-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/eca5/12387229/c7f589b82497/materials-18-03820-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/eca5/12387229/9134f16b2a1f/materials-18-03820-g008.jpg

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本文引用的文献

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Effect of repeating hydrothermal growth processes and rapid thermal annealing on CuO thin film properties.重复水热生长过程和快速热退火对CuO薄膜性能的影响。
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