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大肠杆菌损伤非依赖性UvrBC核酸内切酶活性的表征

Characterization of the Escherichia coli damage-independent UvrBC endonuclease activity.

作者信息

Moolenaar G F, Bazuine M, van Knippenberg I C, Visse R, Goosen N

机构信息

Laboratory of Molecular Genetics, Leiden Institute of Chemistry, Gorlaeus Laboratories, Leiden University, 2300 RA Leiden, The Netherlands.

出版信息

J Biol Chem. 1998 Dec 25;273(52):34896-903. doi: 10.1074/jbc.273.52.34896.

Abstract

Incision of damaged DNA templates by UvrBC in Escherichia coli depends on UvrA, which loads UvrB on the site of the damage. A 50-base pair 3' prenicked DNA substrate containing a cholesterol lesion is incised by UvrABC at two positions 5' to the lesion, the first incision at the eighth and the second at the 15th phosphodiester bond. Analysis of a 5' prenicked cholesterol substrate revealed that the second 5' incision is efficiently produced by UvrBC independent of UvrA. This UvrBC incision was also found on the same substrate without a lesion and, with an even higher efficiency, on a DNA substrate containing a 5' single strand overhang. Incision occurred in the presence of ATP or ADP but not in the absence of cofactor. We could show an interaction between UvrB and UvrC in solution and subsequent binding of this complex to the substrate with a 5' single strand overhang. Analysis of mutant UvrB and UvrC proteins revealed that the damage-independent nuclease activity requires the protein-protein interaction domains, which are exclusively needed for the 3' incision on damaged substrates. However, the UvrBC incision uses the catalytic site in UvrC which makes the 5' incision on damaged DNA substrates.

摘要

在大肠杆菌中,UvrBC对受损DNA模板的切割依赖于UvrA,UvrA将UvrB加载到损伤位点。一个含有胆固醇损伤的50个碱基对的3' 预切口DNA底物被UvrABC在损伤位点5' 端的两个位置切割,第一个切口在损伤位点的第八个磷酸二酯键处,第二个切口在第十五个磷酸二酯键处。对一个5' 预切口胆固醇底物的分析表明,第二个5' 切口由UvrBC高效产生,且不依赖于UvrA。在没有损伤的相同底物上也发现了这种UvrBC切割,在含有5' 单链突出端的DNA底物上,切割效率更高。切割在ATP或ADP存在时发生,但在没有辅因子时不发生。我们能够证明溶液中的UvrB和UvrC之间存在相互作用,并且这种复合物随后与含有5' 单链突出端的底物结合。对UvrB和UvrC突变蛋白的分析表明,不依赖损伤的核酸酶活性需要蛋白质-蛋白质相互作用结构域,而这些结构域是受损底物上3' 切割所特有的。然而,UvrBC切割使用的是UvrC中的催化位点,该位点在受损DNA底物上进行5' 切割。

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