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一维电容式微机械超声浸入式换能器阵列的特性分析

Characterization of one-dimensional capacitive micromachined ultrasonic immersion transducer arrays.

作者信息

Jin X, Oralkan O, Degertekin F L, Khuri-Yakub B T

机构信息

Edward L. Ginzton Laboratory, Stanford University, Stanford, CA 94305-4085, USA.

出版信息

IEEE Trans Ultrason Ferroelectr Freq Control. 2001 May;48(3):750-60. doi: 10.1109/58.920706.

Abstract

In this paper, we report on the characterization of 1-D arrays of capacitive micromachined ultrasonic transducers (cMUT). A 275- x 5600-micron 1-D CMUT array element is experimentally characterized, and the results are found to be in agreement with theoretical predictions. As a receiver, the transducer has a 0.28-fm/square root of Hz displacement sensitivity, and, as a transmitter, it produces 5 kPa/V of output pressure at the transducer surface at 3 MHz with a DC bias of 35 V. The transducer has more than 100% fractional bandwidth around 3 MHz, which makes it suitable for ultrasound imaging. The radiation pattern of isolated single elements, as well as those of array elements are measured, and two major sources of acoustical cross talk are identified. A weakly dispersive non-leaky interface wave (Stoneley wave) is observed to be propagating at the silicon substrate-fluid interface at a speed close to the speed of sound in the fluid. This wave causes internal reflections, spurious resonance, and radiation from the edges of the silicon substrate. The large lateral component of the particle velocity generated by the membranes at the edge of the cMUT array elements is found to be the source of this interface wave. Lowest order Lamb waves in the silicon substrate are also found to contribute to the cross talk between elements. These waves are excited at the edges of individual vibrating membranes, where they are anchored to the substrate, and result in a narrowing of the beam profile of the array elements. Several methods, such as trench isolation and wafer thinning, are proposed and implemented to modify the acoustical cross coupling between array elements.

摘要

在本文中,我们报告了电容式微机械超声换能器(cMUT)一维阵列的特性。对一个275×5600微米的一维CMUT阵列元件进行了实验表征,结果与理论预测相符。作为接收器,该换能器具有0.28飞米/根号赫兹的位移灵敏度,作为发射器,在35 V直流偏置下,其在3 MHz时在换能器表面产生5 kPa/V的输出压力。该换能器在3 MHz左右具有超过100%的分数带宽,这使其适用于超声成像。测量了孤立单元素以及阵列元素的辐射方向图,并确定了两个主要的声学串扰源。观察到一种弱色散非泄漏界面波(斯通利波)在硅基片-流体界面以接近流体中声速的速度传播。这种波会引起内部反射、杂散共振以及从硅基片边缘的辐射。发现cMUT阵列元件边缘处膜产生的粒子速度的大横向分量是这种界面波的来源。还发现硅基片中的最低阶兰姆波也会导致元件之间的串扰。这些波在单个振动膜的边缘被激发,在那里它们与基片相连,并导致阵列元件的波束轮廓变窄。提出并实施了几种方法,如沟槽隔离和晶圆减薄,以改变阵列元件之间的声学交叉耦合。

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