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半薄切片条带:一种使用新型金刚石刀的先进方法。

Ribbons of semithin sections: an advanced method with a new type of diamond knife.

作者信息

Blumer Michael J F, Gahleitner P, Narzt T, Handl C, Ruthensteiner B

机构信息

Institute of Zoology, University of Vienna, Althanstrasse 14, A-1090, Wien, Austria.

出版信息

J Neurosci Methods. 2002 Oct 15;120(1):11-6. doi: 10.1016/s0165-0270(02)00166-8.

Abstract

Complete series of semithin sections are imperative for 3-D reconstruction, but with traditional microtomy techniques it is difficult and time-consuming to trace stained and labeled structures. In the present study we introduce a method for making and collecting ribbons of semithin sections with a new, commercial available diamond knife (histo-jumbo-diamond knife, Diatome AG, Biel, Switzerland). The special feature of the diamond knife is the large water bath (boat) into which a glass slide can be dipped. The method has distinct advantages and the handling is simple. The resin block is trimmed into a truncated pyramid. Contact glue is applied to the leading face of the pyramid, which makes sections stick together to form a ribbon. Following sectioning, the ribbons are mounted onto glass slides and aligned in parallel. Stretching out and drying the ribbons on a hot plate is the final step of the method. Major advantages of this method are the perfect alignment of sections with identical orientation of structures, the completeness of series, and the significant saving of time. This facilitates tracing of stained and labeled structures, yielding quick 3-D reconstruction. Semithin sections can be cut from 0.5 to 2 micro m and several ribbons can be mounted side by side onto the slide. Two examples are presented to illustrate the advantages of the method.

摘要

完整的半薄切片系列对于三维重建至关重要,但使用传统切片技术追踪染色和标记结构既困难又耗时。在本研究中,我们介绍了一种使用新型商用钻石刀(histo-jumbo-diamond knife,Diatome AG,瑞士比尔)制作和收集半薄切片条带的方法。这种钻石刀的特殊之处在于有一个大水槽(舟皿),可以将载玻片浸入其中。该方法具有明显优势,操作简单。将树脂块修整成截顶金字塔形。在金字塔的前端面涂上接触胶,使切片粘在一起形成条带。切片后,将条带安装在载玻片上并平行排列。在热板上展开并干燥条带是该方法的最后一步。此方法的主要优点是切片具有完美的对齐且结构方向相同、系列完整以及显著节省时间。这便于追踪染色和标记结构,从而实现快速三维重建。半薄切片的厚度可以从0.5到2微米,并且可以将多个条带并排安装在载玻片上。给出了两个例子来说明该方法的优点。

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