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用于微机电系统的聚合物微结构制造:牺牲层微成型和图案化衬底微成型。

Fabrication of polymer microstructures for MEMS: sacrificial layer micromolding and patterned substrate micromolding.

作者信息

Ferrell Nicholas, Woodard James, Hansford Derek

机构信息

Biomedical Engineering Center, Ohio State University, 1080 Carmack Rd., 270 Bevis Hall, Columbus, OH 43210, USA.

出版信息

Biomed Microdevices. 2007 Dec;9(6):815-21. doi: 10.1007/s10544-007-9094-y.

Abstract

Two soft lithography based fabrication techniques are employed for fabricating mechanically independent, freely suspended polymer microstructure from poly(n-propyl methacrylate) (PPMA), poly(methyl methacrylate) (PMMA), and polystyrene. Both methods involve a micromolding process followed by thermal bonding to the substrate. The first method, sacrificial layer micromolding, uses a water soluble sacrificial layer, allowing functional structures to be released by immersion in water. The second method, patterned substrate micromolding, uses a permanent substrate patterned via photolithography. Functional regions of the polymer MEMS are suspended over the voids in the photoresist pattern. The processes have been applied to the fabrication of polymer microstructures with a variety of geometries for specific applications. Devices have included microcantilevers, beams, and other more complicated microstructures. The thermal molding process is conceivably applicable to the fabrication of microstructures from a wide variety of thermoplastic polymers, allowing material selection to be tailored based on application.

摘要

采用两种基于软光刻的制造技术,从聚(甲基丙烯酸正丙酯)(PPMA)、聚(甲基丙烯酸甲酯)(PMMA)和聚苯乙烯制造机械独立、自由悬浮的聚合物微结构。这两种方法都包括微成型过程,然后热键合到基板上。第一种方法是牺牲层微成型,使用水溶性牺牲层,通过浸入水中释放功能结构。第二种方法是图案化基板微成型,使用通过光刻图案化的永久性基板。聚合物微机电系统的功能区域悬浮在光刻胶图案中的空隙上方。这些工艺已应用于制造具有各种几何形状的聚合物微结构,以用于特定应用。器件包括微悬臂梁、梁和其他更复杂的微结构。可以想象,热成型工艺适用于由多种热塑性聚合物制造微结构,从而允许根据应用定制材料选择。

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