Hegde Mithra N, Hegde Priyadarshini, Shetty Shibani K
Department of Conservative Dentistry and Endodontics, A. B. Shetty Memorial Institute of Dental Sciences, Deralakatte, Mangalore, Karnataka, India.
J Conserv Dent. 2008 Jul;11(3):127-30. doi: 10.4103/0972-0707.45252.
To investigate whether salivary contamination during various stages of the bonding procedures of Xeno III and Clearfil SE Bond influences shear bond strength.
THE OCCLUSAL SURFACES OF THIRTY SIX MAXILLARY PREMOLAR TEETH WERE GROUND AND DIVIDED INTO TWO GROUPS CONTAINING EIGHTEEN SPECIMENS EACH, WHICH WAS SUBDIVIDED INTO THREE SUB GROUPS: Group I - Xeno III, Group II - Clearfil SE Bond, Subgroup A - Uncontaminated (control), Subgroup B - Contaminated with saliva before application and light curing, Subgroup C - Contaminated with saliva after light curing. Composite resin Filtek Z350 was packed using Teflon mold cured and subjected to shear bond strength analysis using universal Instron machine.
Statistical analysis was made using One-way ANOVA and Tukeys HSD test. Clearfil SE Bond showed very high statistically significant reduction in the bond strength, when salivary contamination took place after light curing; whereas, Xeno III showed very high statistically significant reduction when salivary contamination took place before application and light curing.
Clearfil SE Bond showed more tolerance to salivary contamination of dentin and higher shear bond strength value, when compared to Xeno III.
研究在Xeno III和Clearfil SE Bond粘结程序的不同阶段唾液污染是否会影响剪切粘结强度。
三十六颗上颌前磨牙的咬合面经过打磨,分成两组,每组包含十八个样本,再将每组细分为三个亚组:第一组 - Xeno III,第二组 - Clearfil SE Bond,A亚组 - 未受污染(对照组),B亚组 - 在涂抹和光固化前被唾液污染,C亚组 - 在光固化后被唾液污染。使用聚四氟乙烯模具填充复合树脂Filtek Z350,进行固化,然后使用万能Instron机器进行剪切粘结强度分析。
采用单因素方差分析和Tukey's HSD检验进行统计分析。当光固化后发生唾液污染时,Clearfil SE Bond的粘结强度在统计学上有非常显著的降低;而当在涂抹和光固化前发生唾液污染时,Xeno III的粘结强度在统计学上有非常显著的降低。
与Xeno III相比,Clearfil SE Bond对牙本质的唾液污染表现出更高的耐受性和更高的剪切粘结强度值。