Max Planck Institute of Microstructure Physics, Weinberg 2, D-06120 Halle, Germany.
Adv Mater. 2011 Jan 11;23(2):285-308. doi: 10.1002/adma.201001784.
This article presents an overview of the essential aspects in the fabrication of silicon and some silicon/germanium nanostructures by metal-assisted chemical etching. First, the basic process and mechanism of metal-assisted chemical etching is introduced. Then, the various influences of the noble metal, the etchant, temperature, illumination, and intrinsic properties of the silicon substrate (e.g., orientation, doping type, doping level) are presented. The anisotropic and the isotropic etching behaviors of silicon under various conditions are presented. Template-based metal-assisted chemical etching methods are introduced, including templates based on nanosphere lithography, anodic aluminum oxide masks, interference lithography, and block-copolymer masks. The metal-assisted chemical etching of other semiconductors is also introduced. A brief introduction to the application of Si nanostructures obtained by metal-assisted chemical etching is given, demonstrating the promising potential applications of metal-assisted chemical etching. Finally, some open questions in the understanding of metal-assisted chemical etching are compiled.
本文概述了通过金属辅助化学刻蚀来制造硅和一些硅/锗纳米结构的基本方面。首先,介绍了金属辅助化学刻蚀的基本过程和机制。然后,介绍了贵金属、蚀刻剂、温度、光照以及硅衬底的固有性质(例如取向、掺杂类型、掺杂水平)等各种因素的影响。介绍了硅在不同条件下的各向异性和各向同性蚀刻行为。介绍了基于模板的金属辅助化学刻蚀方法,包括基于纳米球光刻、阳极氧化铝掩模、干涉光刻和嵌段共聚物掩模的模板。还介绍了其他半导体的金属辅助化学刻蚀。简要介绍了通过金属辅助化学刻蚀获得的硅纳米结构的应用,展示了金属辅助化学刻蚀具有广阔的应用前景。最后,总结了在理解金属辅助化学刻蚀方面存在的一些未解决的问题。