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在单晶锗中实现基于供体原子级器件的完整制造路线。

A complete fabrication route for atomic-scale, donor-based devices in single-crystal germanium.

机构信息

School of Physics, University of New South Wales, Sydney, NSW 2052, Australia.

出版信息

Nano Lett. 2011 Jun 8;11(6):2272-9. doi: 10.1021/nl200449v. Epub 2011 May 10.

Abstract

Despite the rapidly growing interest in Ge for ultrascaled classical transistors and innovative quantum devices, the field of Ge nanoelectronics is still in its infancy. One major hurdle has been electron confinement since fast dopant diffusion occurs when traditional Si CMOS fabrication processes are applied to Ge. We demonstrate a complete fabrication route for atomic-scale, donor-based devices in single-crystal Ge using a combination of scanning tunneling microscope lithography and high-quality crystal growth. The cornerstone of this fabrication process is an innovative lithographic procedure based on direct laser patterning of the semiconductor surface, allowing the gap between atomic-scale STM-patterned structures and the outside world to be bridged. Using this fabrication process, we show electron confinement in a 5 nm wide phosphorus-doped nanowire in single-crystal Ge. At cryogenic temperatures, Ohmic behavior is observed and a low planar resistivity of 8.3 kΩ/□ is measured.

摘要

尽管人们对用于超尺度经典晶体管和创新量子器件的 Ge 表现出浓厚的兴趣,但 Ge 纳米电子学领域仍处于起步阶段。一个主要的障碍是电子限制,因为当传统的 Si CMOS 制造工艺应用于 Ge 时,快速的掺杂扩散会发生。我们使用扫描隧道显微镜光刻和高质量晶体生长的组合,展示了在单晶 Ge 中基于原子级施主的器件的完整制造途径。该制造过程的基石是一种创新的光刻工艺,该工艺基于对半导体表面的直接激光图案化,允许原子级 STM 图案化结构与外部世界之间的间隙得以连接。使用这种制造工艺,我们在单晶 Ge 中的 5nm 宽磷掺杂纳米线中观察到电子限制。在低温下,观察到欧姆行为,并测量出低平面电阻率为 8.3kΩ/□。

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