IBM T J Watson Research Center, 1101 Kitchawan Road, Yorktown Heights, NY 10598, USA.
Nanotechnology. 2011 Jul 8;22(27):275304. doi: 10.1088/0957-4484/22/27/275304. Epub 2011 May 20.
Solid state nanopores are a core element of next-generation single molecule tools in the field of nano-biotechnology. Thin film electrodes integrated into a pore can interact with charges and fields within the pore. In order to keep the nanopore open and thus functional electrochemically induced surface alteration of electrode surfaces and bubble formation inside the pore have to be eliminated. This paper provides electrochemical analyses of nanopores drilled into TiN membranes which in turn were employed as thin film electrodes. We studied physical pore integrity and the occurrence of water decomposition yielding bubble formation inside pores by applying voltages between -4.5 and +4.5 V to membranes in various protection stages continuously for up to 24 h. During potential application pores were exposed to selected electrolyte-solvent systems. We have investigated and successfully eliminated electrochemical pore oxidation and reduction as well as water decomposition inside nanopores of various diameters ranging from 3.5 to 25 nm in 50 nm thick TiN membranes by passivating the nanopores with a plasma-oxidized layer and using a 90% solution of glycerol in water as KCl solvent. Nanopore ionic conductances were measured before and after voltage application in order to test for changes in pore diameter due to electrochemical oxidation or reduction. TEM imaging was used to confirm these observations. While non-passivated pores were electrochemically oxidized, neither electrochemical oxidation nor reduction was observed for passivated pores. Bubble formation through water decomposition could be detected in non-passivated pores in KCl/water solutions but was not observed in 90% glycerol solutions. The use of a protective self-assembled monolayer of hexadecylphosphonic acid (HDPA) was also investigated.
固态纳米孔是纳米生物技术领域下一代单分子工具的核心元件。集成到孔中的薄膜电极可以与孔内的电荷和场相互作用。为了保持纳米孔的开放状态,从而保持其电化学功能,必须消除电极表面的电致表面变化和孔内的气泡形成。本文提供了对 TiN 膜中纳米孔的电化学分析,TiN 膜反过来又被用作薄膜电极。我们通过在各种保护阶段将-4.5V 至+4.5V 的电压连续施加到膜上长达 24 小时,研究了物理孔完整性和水分解导致孔内气泡形成的情况。在施加电位期间,将孔暴露于选定的电解质-溶剂系统中。我们已经研究并成功消除了不同直径(3.5nm 至 25nm)的纳米孔中的电化学氧化还原和水分解,这些纳米孔位于 50nm 厚的 TiN 膜中,方法是用等离子体氧化层钝化纳米孔并使用 90%的甘油水溶液作为 KCl 溶剂。在施加电压之前和之后测量纳米孔的离子电导率,以测试由于电化学氧化或还原导致的孔径变化。TEM 成像用于证实这些观察结果。虽然未钝化的孔被电化学氧化,但钝化的孔未观察到电化学氧化或还原。在未钝化的孔中可以检测到 KCl/水溶液中的水分解产生的气泡,但在 90%甘油溶液中未观察到气泡。还研究了十六烷基磷酸(HDPA)的保护性自组装单层的使用。