IEEE Trans Biomed Circuits Syst. 2011 Jun;5(3):262-71. doi: 10.1109/TBCAS.2010.2078815.
This paper presents a neural recording amplifier array suitable for large-scale integration with multielectrode arrays in very low-power microelectronic cortical implants. The proposed amplifier is one of the most energy-efficient structures reported to date, which theoretically achieves an effective noise efficiency factor (NEF) smaller than the limit that can be achieved by any existing amplifier topology, which utilizes a differential pair input stage. The proposed architecture, which is referred to as a partial operational transconductance amplifier sharing architecture, results in a significant reduction of power dissipation as well as silicon area, in addition to the very low NEF. The effect of mismatch on crosstalk between channels and the tradeoff between noise and crosstalk are theoretically analyzed. Moreover, a mathematical model of the nonlinearity of the amplifier is derived, and its accuracy is confirmed by simulations and measurements. For an array of four neural amplifiers, measurement results show a midband gain of 39.4 dB and a -3-dB bandwidth ranging from 10 Hz to 7.2 kHz. The input-referred noise integrated from 10 Hz to 100 kHz is measured at 3.5 μVrms and the power consumption is 7.92 μW from a 1.8-V supply, which corresponds to NEF = 3.35. The worst-case crosstalk and common-mode rejection ratio within the desired bandwidth are - 43.5 dB and 70.1 dB, respectively, and the active silicon area of each amplifier is 256 μm × 256 μm in 0.18-μm complementary metal-oxide semiconductor technology.
本文提出了一种适用于与微电子产品皮层植入物中的多电极阵列进行大规模集成的神经记录放大器阵列。所提出的放大器是迄今为止报道的最节能的结构之一,理论上实现了有效噪声效率因子 (NEF) 小于任何现有放大器拓扑结构所能达到的极限,而该拓扑结构利用差分对输入级。所提出的架构,称为部分运算跨导放大器共享架构,除了非常低的 NEF 之外,还显著降低了功耗和硅面积。从理论上分析了失配对通道间串扰的影响以及噪声和串扰之间的权衡。此外,还推导出了放大器非线性的数学模型,并通过仿真和测量验证了其准确性。对于四个神经放大器阵列的测量结果表明,中频增益为 39.4dB,-3dB 带宽范围为 10Hz 至 7.2kHz。从 1.8V 电源汲取的 10Hz 至 100kHz 的输入参考噪声测量值为 3.5μVrms,功耗为 7.92μW,对应的 NEF=3.35。在所需带宽内,最坏情况下的串扰和共模抑制比分别为-43.5dB 和 70.1dB,每个放大器的有源硅面积为 0.18μm 互补金属氧化物半导体技术中的 256μm×256μm。