Rani Sudheer D, Park Taehyun, You Byoung Hee, Soper Steve A, Murphy Michael C, Nikitopoulos Dimitris E
Washington University in St. Louis, Department of Radiology, Saint Louis, MO, USA.
Electrophoresis. 2013 Nov;34(20-21):2988-95. doi: 10.1002/elps.201300110. Epub 2013 Oct 9.
Minimizing misalignments during the interconnection of microfluidic modules is extremely critical to develop a fully integrated microfluidic device. Misalignments arising during chip-to-chip or world-to-chip interconnections can be greatly detrimental to efficient functioning of microfluidic devices. To address this problem, we have performed numerical simulations to investigate the effect of misalignments arising in three types of interconnection methods: (i) end-to-end interconnection (ii) channel overlap when chips are stacked on top of each other, and (iii) tube-in-reservoir misalignment occurring due to the offset between the external tubing and the reservoir. For the case of end-to-end interconnection, the effect of misalignment was investigated for 0, 13, 50, 58, and 75% reduction in the available flow area at the location of geometrical misalignment. In the channel overlap interconnection method, various possible misalignment configurations were simulated by maintaining the same amount of misalignment (75% flow area reduction). The effect of misalignment in a tube-in-reservoir interconnection was investigated by positioning the tube at an offset of 164 μm from the reservoir center. All the results were evaluated in terms of the equivalent length of a straight pipe. The effect of Reynolds number (Re) was also taken into account by performing additional simulations of aforementioned cases at Re ranging between 0.075 ≤ Re ≤ 75. Correlations were developed and the results were interpreted in terms of equivalent length (Le ). Equivalent length calculations revealed that the effect of misalignment in tube-in-reservoir interconnection method was the least significant when compared to the other two methods of interconnection.
在微流控模块互连过程中尽量减少对准误差对于开发完全集成的微流控设备极为关键。芯片与芯片或芯片与外界互连过程中出现的对准误差可能会极大地损害微流控设备的高效运行。为了解决这个问题,我们进行了数值模拟,以研究三种互连方法中出现的对准误差的影响:(i)端对端互连;(ii)芯片相互堆叠时通道重叠;(iii)由于外部管道与储液器之间的偏移而导致的管在储液器中的对准误差。对于端对端互连的情况,研究了在几何对准位置处可用流动面积减少0%、13%、50%、58%和75%时对准误差的影响。在通道重叠互连方法中,通过保持相同的对准误差量(流动面积减少75%)模拟了各种可能的对准配置。通过将管道定位在距储液器中心164μm的偏移处,研究了管在储液器互连中对准误差的影响。所有结果均根据直管的等效长度进行评估。还通过在0.075≤Re≤75范围内对上述情况进行额外模拟,考虑了雷诺数(Re)的影响。建立了相关性,并根据等效长度(Le)对结果进行了解释。等效长度计算表明,与其他两种互连方法相比,管在储液器互连方法中对准误差的影响最小。