Department of Quantum Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya, Aichi 464-8603, Japan.
Nat Commun. 2013;4:2302. doi: 10.1038/ncomms3302.
A variety of plastic products, ranging from those for daily necessities to electronics products and medical devices, are produced by moulding techniques. The incorporation of electronic circuits into various plastic products is limited by the brittle nature of silicon wafers. Here we report mouldable integrated circuits for the first time. The devices are composed entirely of carbon-based materials, that is, their active channels and passive elements are all fabricated from stretchable and thermostable assemblies of carbon nanotubes, with plastic polymer dielectric layers and substrates. The all-carbon thin-film transistors exhibit a mobility of 1,027 cm(2) V(-1) s(-1) and an ON/OFF ratio of 10(5). The devices also exhibit extreme biaxial stretchability of up to 18% when subjected to thermopressure forming. We demonstrate functional integrated circuits that can be moulded into a three-dimensional dome. Such mouldable electronics open new possibilities by allowing for the addition of electronic/plastic-like functionalities to plastic/electronic products, improving their designability.
各种塑料制品，从日用品到电子产品和医疗器械，都是通过模具成型技术生产的。将电子电路集成到各种塑料制品中受到硅片脆性的限制。在这里，我们首次报告了可模压集成电路。这些器件完全由基于碳的材料组成，即它们的有源通道和无源元件均由可拉伸和热稳定的碳纳米管组装而成，具有塑料聚合物介电层和基底。全碳薄膜晶体管的迁移率为 1027cm2V-1s-1，ON/OFF 比为 10(5)。当受到热压成型时，器件还表现出高达 18%的极端双轴拉伸性。我们展示了可以模压成三维穹顶的功能集成电路。这种可模压电子产品通过为塑料/电子产品增加电子/塑料样的功能，提高其设计性，开辟了新的可能性。
