Electrical and Electronic Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo, 113-8656, Japan; Department of Materials Science and Engineering, The University of Texas at Dallas, 800 W. Campbell Rd., Richardson, Texas, 75080-3021, USA.
Adv Mater. 2014 Aug 6;26(29):4967-73. doi: 10.1002/adma.201400420. Epub 2014 Apr 15.
A unique form of adaptive electronics is demonstrated, which change their mechanical properties from rigid and planar to soft and compliant, in order to enable soft and conformal wrapping around 3D objects, including biological tissue. These devices feature excellent mechanical robustness and maintain initial electrical properties even after changing shape and stiffness.
展示了一种独特形式的自适应电子学,它可以将其机械性能从刚性和平面转变为柔软和顺应性,从而能够实现对包括生物组织在内的 3D 物体的柔软和顺应性包裹。这些器件具有出色的机械鲁棒性,即使在改变形状和刚度后,仍能保持初始的电气性能。