Department of Mechanical Engineering, Carnegie Mellon University; Pittsburgh, Pennsylvania 15213, United States.
Department of Materials Science and Engineering, Carnegie Mellon University; Pittsburgh, Pennsylvania 15213, United States.
ACS Nano. 2023 Feb 14;17(3):2602-2610. doi: 10.1021/acsnano.2c10525. Epub 2023 Jan 17.
Despite the recent advancements of passive and active cooling solutions for electronics, interfaces between materials have generally become crucial barriers for thermal transport because of intrinsic material dissimilarity and surface roughness at interfaces. We demonstrate a 3D graphene-nanowire "sandwich" thermal interface that enables an ultralow thermal resistance of ∼0.24 mm·K/W that is about 1 order of magnitude smaller than those of solders and several orders of magnitude lower than those of thermal greases, gels, and epoxies, as well as a low elastic and shear moduli of ∼1 MPa like polymers and foams. The flexible 3D "sandwich" exhibits excellent long-term reliability with >1000 cycles over a broad temperature range from -55 °C to 125 °C. This nanostructured thermal interface material can greatly benefit a variety of electronic systems and devices by allowing them to operate at lower temperatures or at the same temperature but with higher performance and higher power density.
尽管最近在电子设备的被动和主动冷却解决方案方面取得了进展，但由于材料的固有不相似性和界面处的表面粗糙度，材料之间的界面通常成为热传输的关键障碍。我们展示了一种 3D 石墨烯纳米线“夹层”热界面，其热阻可低至约 0.24 mm·K/W，比焊料低约 1 个数量级，比热油脂、凝胶和环氧树脂低几个数量级，弹性和剪切模量也低至约 1 MPa，与聚合物和泡沫相当。这种灵活的 3D“夹层”在很宽的温度范围内（-55°C 至 125°C）具有超过 1000 次的优异长期可靠性。这种纳米结构的热界面材料可以通过允许各种电子系统和设备在较低温度下运行，或者在相同温度下但具有更高性能和更高功率密度来极大地受益于它们。
