Zuo Haijie, Choi Duk-Yong, Gai Xin, Luther-Davies Barry, Zhang Baoping
Opt Express. 2017 Feb 20;25(4):3069-3076. doi: 10.1364/OE.25.003069.
We present a novel CMOS-compatible fabrication technique for convex micro-nano lens arrays (MNLAs) with high packing density on the wafer scale. By means of conformal chemical vapor deposition (CVD) of hydrogenated amorphous silicon (a-Si:H) following patterning of silicon pillars via electron beam lithography (EBL) and plasma etching, large areas of a close packed silicon lens array with the diameter from a few micrometers down to a few hundred nanometers was fabricated. The resulting structure shows excellent surface roughness and high uniformity. The optical focusing properties of the lenses at infrared wavelengths were verified by experimental measurements and numerical simulation. This approach provides a feasible solution for fabricating silicon MNLAs compatible for next generation large scale, miniaturized optical imaging detectors and related optical devices.
我们提出了一种新颖的互补金属氧化物半导体（CMOS）兼容制造技术，用于在晶圆级上制造具有高填充密度的凸面微纳透镜阵列（MNLA）。通过电子束光刻（EBL）和等离子体蚀刻对硅柱进行图案化后，采用氢化非晶硅（a-Si:H）的共形化学气相沉积（CVD）方法，制造出了大面积的紧密排列的硅透镜阵列，其直径从几微米到几百纳米不等。所得结构具有出色的表面粗糙度和高均匀性。通过实验测量和数值模拟验证了透镜在红外波长下的光学聚焦特性。这种方法为制造与下一代大规模、小型化光学成像探测器及相关光学器件兼容的硅MNLA提供了一种可行的解决方案。
