Department of Display and Semiconductor Physics, Korea University , Sejong 30019, Republic of Korea.
Department of Chemistry and Institute of Biological Interfaces, Sogang University , Seoul 04107, Republic of Korea.
ACS Appl Mater Interfaces. 2017 Aug 16;9(32):26974-26982. doi: 10.1021/acsami.7b05672. Epub 2017 Aug 2.
We present the development of a flexible bimodal sensor using a paper platform and inkjet printing method, which are suited for low-cost fabrication processes and realization of flexible devices. In this study, we employed a vertically stacked bimodal device architecture in which a temperature sensor is stacked on top of a pressure sensor and operated on different principles, allowing the minimization of interference effects. For the temperature sensor placed in the top layer, we used the thermoelectric effect and formed a closed-loop thermocouple composed of two different printable inks (conductive PEDOT:PSS and silver nanoparticles on a flexible paper platform) and obtained temperature-sensing capability over a wide range (150 °C). For the pressure sensor positioned in the bottom layer, we used microdimensional pyramid-structured poly(dimethylsiloxane) coated with multiwall carbon nanotube conducting ink. Our pressure sensor exhibits a high-pressure sensitivity over a wide range (100 Pa to 5 kPa) and high-endurance characteristics of 10. Our 5 × 5 bimodal sensor array demonstrates negligible interference, high-speed responsivity, and robust sensing characteristics. We believe that the material, process, two-terminal device, and integration scheme developed in this study have a great value that can be widely applied to electronic skin.
我们提出了一种使用纸张平台和喷墨打印方法的灵活双模传感器的开发,这非常适合低成本制造工艺和实现柔性器件。在这项研究中,我们采用了垂直堆叠的双模器件结构,其中温度传感器堆叠在压力传感器之上,并基于不同的原理运行,从而最小化了干扰效应。对于放置在上层的温度传感器,我们利用了热电效应,并形成了由两种不同的可打印油墨(导电PEDOT:PSS 和银纳米粒子在柔性纸张平台上)组成的闭环热电偶,从而获得了宽范围(150°C)的温度感应能力。对于位于底层的压力传感器,我们使用了涂有多壁碳纳米管导电油墨的微尺寸金字塔结构聚二甲基硅氧烷。我们的压力传感器在宽范围(100 Pa 至 5 kPa)内具有高灵敏度和高耐用性特征,可承受 10 次循环。我们的 5×5 双模传感器阵列展示出了可忽略的干扰、高速响应性和稳健的传感特性。我们相信,本研究中开发的材料、工艺、两端器件和集成方案具有很大的价值,可以广泛应用于电子皮肤。