Kim Sungjun, Chang Yao-Feng, Kim Min-Hwi, Kim Tae-Hyeon, Kim Yoon, Park Byung-Gook
Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul 08826, Korea.
Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, TX 78758, USA.
Materials (Basel). 2017 Apr 26;10(5):459. doi: 10.3390/ma10050459.
Here, we present evidence of self-compliant and self-rectifying bipolar resistive switching behavior in Ni/SiN/n⁺ Si and Ni/SiN/n Si resistive-switching random access memory devices. The Ni/SiN/n Si device's Si bottom electrode had a higher dopant concentration (As ion > 10 cm) than the Ni/SiN/n⁺ Si device; both unipolar and bipolar resistive switching behaviors were observed for the higher dopant concentration device owing to a large current overshoot. Conversely, for the device with the lower dopant concentration (As ion < 10 cm), self-rectification and self-compliance were achieved owing to the series resistance of the Si bottom electrode.
在此,我们展示了Ni/SiN/n⁺Si和Ni/SiN/n Si电阻式开关随机存取存储器器件中自顺应和自整流双极电阻开关行为的证据。Ni/SiN/n Si器件的Si底部电极比Ni/SiN/n⁺Si器件具有更高的掺杂剂浓度(砷离子>10¹⁹ cm⁻³);由于大电流过冲,对于较高掺杂剂浓度的器件观察到了单极和双极电阻开关行为。相反,对于较低掺杂剂浓度(砷离子<10¹⁹ cm⁻³)的器件,由于Si底部电极的串联电阻实现了自整流和自顺应。