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通过硅烷化合物改性和快速热退火来控制硅片上电沉积镍-磷膜的附着力。

Manipulating the adhesion of electroless nickel-phosphorus film on silicon wafers by silane compound modification and rapid thermal annealing.

机构信息

Department of Chemical Engineering, National Tsing Hua University, Hsinchu, 30013, Taiwan.

出版信息

Sci Rep. 2017 Aug 29;7(1):9656. doi: 10.1038/s41598-017-08639-x.

DOI:10.1038/s41598-017-08639-x
PMID:28851883
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC5574985/
Abstract

In this study, the effect of 3-2-(2-aminoethylamino) ethylamino propyl trimethoxysilane (ETAS) modification and post rapid thermal annealing (RTA) treatment on the adhesion of electroless plated nickel-phosphorus (ELP Ni-P) film on polyvinyl alcohol-capped palladium nanoclusters (PVA-Pd) catalyzed silicon wafers is systematically investigated. Characterized by pull-off adhesion, atomic force microscopy, X-ray spectroscopy and water contact angle, a time-dependent, three-staged ETAS grafting mechanism including islandish grafting, a self-assembly monolayer (SAM) and multi-layer grafting is proposed and this mechanism is well correlated to the pull-off adhesion of ELP Ni-P film. In the absence of RTA, the highest ELP Ni-P film adhesion occurs when ETAS modification approaches SAM, where insufficient or multi-layer ETAS grafting fails to provide satisfactory results. On the other hand, if RTA is applied, the best ELP Ni-P film adhesion happens when ETAS modification is islandish owing to the formation of nickel silicide, where SAM or multi-layer ETAS modification cannot provide satisfactory adhesion because the interaction between ETAS and PVA-Pd has been sabotaged during RTA. Evidenced by microstructural images, we also confirmed that ETAS can act as an efficient barrier layer for nickel diffusion to bulk silicon.

摘要

在这项研究中,系统地研究了 3-2-(2-氨乙基氨基)乙基氨基丙基三甲氧基硅烷(ETAS)修饰和后快速热退火(RTA)处理对聚乙烯醇封端钯纳米簇(PVA-Pd)催化硅片上电沉积镍磷(ELP Ni-P)膜附着力的影响。通过剥离附着力、原子力显微镜、X 射线光谱和水接触角进行了表征,提出了一种时间依赖性的、三阶段的 ETAS 接枝机制,包括岛状接枝、自组装单层(SAM)和多层接枝,该机制与 ELP Ni-P 膜的剥离附着力很好地相关。在没有 RTA 的情况下,当 ETAS 修饰接近 SAM 时,ELP Ni-P 膜的附着力最高,此时不足或多层 ETAS 接枝无法提供满意的结果。另一方面,如果施加 RTA,则当 ETAS 修饰为岛状时,ELP Ni-P 膜的附着力最佳,这是因为形成了镍硅化物,而 SAM 或多层 ETAS 修饰不能提供满意的附着力,因为在 RTA 过程中,ETAS 和 PVA-Pd 之间的相互作用已被破坏。通过微观结构图像,我们还证实了 ETAS 可以作为镍向体硅扩散的有效阻挡层。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/35f7/5574985/39c70e6290a3/41598_2017_8639_Fig9_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/35f7/5574985/3e6a36775565/41598_2017_8639_Fig1_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/35f7/5574985/ccbefd958034/41598_2017_8639_Fig2_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/35f7/5574985/26597aa34ddb/41598_2017_8639_Fig3_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/35f7/5574985/68d5b038bfe0/41598_2017_8639_Fig4_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/35f7/5574985/b8f5dbb65a51/41598_2017_8639_Fig5_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/35f7/5574985/1337bf5d1842/41598_2017_8639_Fig6_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/35f7/5574985/b21825f7c8b8/41598_2017_8639_Fig7_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/35f7/5574985/4e0dfd9ce0b2/41598_2017_8639_Fig8_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/35f7/5574985/39c70e6290a3/41598_2017_8639_Fig9_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/35f7/5574985/3e6a36775565/41598_2017_8639_Fig1_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/35f7/5574985/ccbefd958034/41598_2017_8639_Fig2_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/35f7/5574985/26597aa34ddb/41598_2017_8639_Fig3_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/35f7/5574985/68d5b038bfe0/41598_2017_8639_Fig4_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/35f7/5574985/b8f5dbb65a51/41598_2017_8639_Fig5_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/35f7/5574985/1337bf5d1842/41598_2017_8639_Fig6_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/35f7/5574985/b21825f7c8b8/41598_2017_8639_Fig7_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/35f7/5574985/4e0dfd9ce0b2/41598_2017_8639_Fig8_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/35f7/5574985/39c70e6290a3/41598_2017_8639_Fig9_HTML.jpg

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