Zhang Qi, Yang Xiong, Hu Qinglei, Bai Ke, Yin Fangfang, Li Ning, Gang Yadong, Wang Xiaojun, Zeng Shaoqun
Collaborative Innovation Center for Biomedical Engineering, Wuhan National Laboratory for Optoelectronics-Huazhong University of Science and Technology, Wuhan, Hubei 430074, China.
Britton Chance Center and MOE Key Laboratory for Biomedical Photonics, School of Engineering Sciences, Huazhong University of Science and Technology, Wuhan, Hubei 430074, China.
Biomed Opt Express. 2017 Nov 27;8(12):5767-5775. doi: 10.1364/BOE.8.005767. eCollection 2017 Dec 1.
To resolve fine structures of biological systems like neurons, it is required to realize microscopic imaging with sufficient spatial resolution in three dimensional systems. With regular optical imaging systems, high lateral resolution is accessible while high axial resolution is hard to achieve in a large volume. We introduce an imaging system for high 3D resolution fluorescence imaging of large volume tissues. Selective plane illumination was adopted to provide high axial resolution. A scientific CMOS working in sub-array mode kept the imaging area in the sample surface, which restrained the adverse effect of aberrations caused by inclined illumination. Plastic embedding and precise mechanical sectioning extended the axial range and eliminated distortion during the whole imaging process. The combination of these techniques enabled 3D high resolution imaging of large tissues. Fluorescent bead imaging showed resolutions of 0.59 μm, 0.47μm, and 0.59 μm in the x, y, and z directions, respectively. Data acquired from the volume sample of brain tissue demonstrated the applicability of this imaging system. Imaging of different depths showed uniform performance where details could be recognized in either the near-soma area or terminal area, and fine structures of neurons could be seen in both the xy and xz sections.
为了分辨神经元等生物系统的精细结构,需要在三维系统中实现具有足够空间分辨率的显微成像。对于常规光学成像系统,虽然可以获得高横向分辨率,但在大体积样本中很难实现高轴向分辨率。我们介绍一种用于大体积组织的高3D分辨率荧光成像系统。采用选择性平面照明以提供高轴向分辨率。工作在子阵列模式的科学级互补金属氧化物半导体(scientific CMOS)将成像区域保持在样本表面,这抑制了倾斜照明引起的像差的不利影响。塑料包埋和精确的机械切片扩展了轴向范围,并在整个成像过程中消除了畸变。这些技术的结合实现了大组织的3D高分辨率成像。荧光微球成像在x、y和z方向上的分辨率分别为0.59μm、0.47μm和0.59μm。从脑组织体积样本获取的数据证明了该成像系统的适用性。不同深度的成像显示出均匀的性能,在近胞体区域或终末区域都能识别细节,并且在xy和xz切片中都能看到神经元的精细结构。