Sorger P K, Pelham H R
MRC Laboratory of Molecular Biology, Cambridge, England.
Cell. 1988 Sep 9;54(6):855-64. doi: 10.1016/s0092-8674(88)91219-6.
Heat shock promoters contain one or more binding sites for a specific heat shock factor (HSF). We report the cloning and sequence of the gene encoding yeast HSF, and demonstrate that HSF is required for growth at normal temperatures (15 degrees C-30 degrees C). The activity of a promoter containing a synthetic HSF binding site varies over a 200-fold range between 15 degrees C and 39 degrees C (heat shock). This change in activity is accompanied by multiple changes in the phosphorylation state of HSF, but all forms of HSF are able to bind DNA. We propose that the expression of heat shock genes in yeast is modulated by phosphorylation of DNA-bound HSF, and that this leads to a more efficient interaction of the factor with other components of the transcriptional machinery.
热休克启动子含有一个或多个特定热休克因子(HSF)的结合位点。我们报道了编码酵母HSF的基因的克隆和序列,并证明HSF是正常温度(15摄氏度至30摄氏度)下生长所必需的。含有合成HSF结合位点的启动子的活性在15摄氏度至39摄氏度(热休克)之间变化200倍。活性的这种变化伴随着HSF磷酸化状态的多重变化,但所有形式的HSF都能够结合DNA。我们提出酵母中热休克基因的表达受与DNA结合的HSF磷酸化的调节,并且这导致该因子与转录机制的其他组分更有效的相互作用。