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使用选区分子束外延技术自下而上制造 InAs 无衬底 MOSFET。

Bottom-up fabrication of InAs-on-nothing MOSFET using selective area molecular beam epitaxy.

机构信息

Univ. Lille, CNRS, Centrale Lille, ISEN, Univ. Valenciennes, UMR 8520 - IEMN, F-59000 Lille, France.

出版信息

Nanotechnology. 2019 Jan 18;30(3):035301. doi: 10.1088/1361-6528/aaebbd.

Abstract

In this paper we report on the fabrication and electrical characterization of InAs-on-nothing metal-oxide-semiconductor field-effect transistor composed of a suspended InAs channel and raised InAs n+ contacts. This architecture is obtained using 3D selective and localized molecular beam epitaxy on a lattice mismatched InP substrate. The suspended InAs channel and InAs n+ contacts feature a reproducible and uniform shape with well-defined 3D sidewalls. Devices with 1 μm gate length present a saturation drain current (I ) of 300 mA mm at V  = 0.8 V and a trans-conductance (G ) of 120 mS mm at V  = 0.5 V. In terms of electrostatic control, the devices display a minimal subthreshold swing of 110 mV dec at V  = 0.5 V and a small drain induced barrier lowering of 50 mV V.

摘要

在本文中,我们报告了由悬浮 InAs 沟道和凸起的 InAs n+ 接触组成的无衬底金属氧化物半导体场效应晶体管的制造和电学特性。该结构是通过在晶格失配的 InP 衬底上使用 3D 选择性和局部分子束外延获得的。悬浮 InAs 沟道和 InAs n+ 接触具有可重复和均匀的形状,具有明确定义的 3D 侧壁。栅长为 1μm 的器件在 V=0.8V 时饱和漏极电流(I)为 300mA/mm,在 V=0.5V 时跨导(G)为 120mS/mm。在静电控制方面,器件在 V=0.5V 时显示出最小的亚阈值摆幅为 110mV/dec,漏极感应势垒降低为 50mV/V。

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