Sun Youlei, Wang Ying, Tang Jianxiang, Wang Wenju, Huang Yifei, Kuang Xiaofei
The Key Laboratory of RF Circuits and Systems, Ministry of Education, Hangzhou Dianzi University, Hangzhou 310018, China.
Micromachines (Basel). 2019 Jan 26;10(2):91. doi: 10.3390/mi10020091.
In this paper, an AlGaN/GaN Schottky barrier diode (SBD) with the T-anode located deep into the bottom buffer layer in combination with field plates (TAI-BBF FPs SBD) is proposed. The electrical characteristics of the proposed structure and the conventional AlGaN/GaN SBD with gated edge termination (GET SBD) were simulated and compared using a Technology Computer Aided Design (TCAD) tool. The results proved that the breakdown voltage (V) in the proposed structure was tremendously improved when compared to the GET SBD. This enhancement is attributed to the suppression of the anode tunneling current by the T-anode and the redistribution of the electric field in the anode⁻cathode region induced by the field plates (FPs). Moreover, the T-anode had a negligible effect on the two-dimensional electron gas (2DEG) in the channel layer, so there is no deterioration in the forward characteristics. After being optimized, the proposed structure exhibited a low turn-on voltage (V) of 0.53 V and a specific on-resistance (R) of 0.32 mΩ·cm², which was similar to the GET SBD. Meanwhile, the TAI-BBF FP SBD with an anode-cathode spacing of 5 μm achieved a V of 1252 V, which was enhanced almost six times compared to the GET SBD with a V of 213 V.
本文提出了一种将T形阳极深入底部缓冲层并结合场板的AlGaN/GaN肖特基势垒二极管(SBD)(TAI-BBF FP SBD)。使用技术计算机辅助设计(TCAD)工具对所提出结构以及具有栅控边缘终端的传统AlGaN/GaN SBD(GET SBD)的电学特性进行了模拟和比较。结果证明,与GET SBD相比,所提出结构的击穿电压(V)有了极大提高。这种增强归因于T形阳极对阳极隧穿电流的抑制以及场板(FPs)在阳极 - 阴极区域引起的电场重新分布。此外,T形阳极对沟道层中的二维电子气(2DEG)影响可忽略不计,因此正向特性没有恶化。经过优化后,所提出的结构表现出0.53 V的低开启电压(V)和0.32 mΩ·cm²的比导通电阻(R),这与GET SBD相似。同时,阳极 - 阴极间距为5μm的TAI-BBF FP SBD实现了1252 V的V,与V为213 V的GET SBD相比提高了近六倍。