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智能互补金属氧化物半导体中红外传感器阵列

Smart CMOS mid-infrared sensor array.

作者信息

Popa Daniel, Ali Syed Zeeshan, Hopper Richard, Dai Ying, Udrea Florin

出版信息

Opt Lett. 2019 Sep 1;44(17):4111-4114. doi: 10.1364/OL.44.004111.

Abstract

We present a novel single-chip thermopile sensor array for mid-infrared room temperature imaging. The array is fabricated on a single complementary metal-oxide-semiconductor (CMOS) dielectric membrane, composed of single-crystal silicon (Si) p and n elements, and standard CMOS tungsten metal layers for thermopile cold junction heatsinking, significantly reducing the chip size and simplifying its processing. We demonstrate a 16×16 pixel device with 34 V/W responsivity and enhanced optical absorption in the 8-14 μm waveband, with a suitable performance for gesture recognition and people-counting applications. Our simple, low-cost sensor is an attractive on-chip array for a variety of applications in the mid-infrared spectral region.

摘要

我们展示了一种用于中红外室温成像的新型单芯片热电堆传感器阵列。该阵列制作在单个互补金属氧化物半导体(CMOS)介电膜上,由单晶硅(Si)的p型和n型元件以及用于热电堆冷结散热的标准CMOS钨金属层组成,显著减小了芯片尺寸并简化了其加工过程。我们展示了一款16×16像素的器件,其响应率为34 V/W,在8 - 14μm波段具有增强的光吸收,适用于手势识别和人数统计应用。我们这种简单、低成本的传感器是中红外光谱区域各种应用中颇具吸引力的片上阵列。

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