Janek Florian, Saller Ebru, Müller Ernst, Meißner Thomas, Weser Sascha, Barth Maximilian, Eberhardt Wolfgang, Zimmermann André
Hahn-Schickard, Allmandring 9b, 70569 Stuttgart, Germany.
Institute for Micro Integration (IFM), University of Stuttgart, Allmandring 9B, 70569 Stuttgart, Germany.
Micromachines (Basel). 2020 Jun 30;11(7):654. doi: 10.3390/mi11070654.
This paper presents a feasibility study of an automated pick-and-place process for ultrathin chips on a standard automatic assembly machine. So far, scientific research about automated assembly of ultrathin chips, with thicknesses less than 50 µm, is missing, but is necessary for cost-effective, high-quantity production of system-in-foil for applications in narrow spaces or flexible smart health systems applied in biomedical applications. Novel pick-and-place tools for ultrathin chip handling were fabricated and a process for chip detachment from thermal release foil was developed. On this basis, an adhesive bonding process for ultrathin chips with 30 µm thickness was developed and transferred to an automatic assembly machine. Multiple ultrathin chips aligned to each other were automatically placed and transferred onto glass and polyimide foil with a relative placement accuracy of ±25 µm.
本文介绍了在标准自动装配机上对超薄芯片进行自动拾取和放置过程的可行性研究。到目前为止，关于厚度小于50微米的超薄芯片自动装配的科学研究尚属空白，但对于在狭窄空间应用的箔中系统或生物医学应用中的柔性智能健康系统进行经济高效的大批量生产而言，这是必要的。制造了用于处理超薄芯片的新型拾取和放置工具，并开发了从热释放箔上分离芯片的工艺。在此基础上，开发了一种用于30微米厚超薄芯片的粘合剂粘结工艺，并将其转移到自动装配机上。相互对齐的多个超薄芯片被自动放置并转移到玻璃和聚酰亚胺箔上，相对放置精度为±25微米。
