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用于柔性电子产品可靠性研究的弯曲设置

Bending Setups for Reliability Investigation of Flexible Electronics.

作者信息

Saleh Rafat, Barth Maximilian, Eberhardt Wolfgang, Zimmermann André

机构信息

Hahn-Schickard, Allmandring 9b, 70569 Stuttgart, Germany.

Institute for Micro Integration (IFM), University of Stuttgart, Allmandring 9B, 70569 Stuttgart, Germany.

出版信息

Micromachines (Basel). 2021 Jan 13;12(1):78. doi: 10.3390/mi12010078.

Abstract

Flexible electronics is a rapidly growing technology for a multitude of applications. Wearables and flexible displays are some application examples. Various technologies and processes are used to produce flexible electronics. An important aspect to be considered when developing these systems is their reliability, especially with regard to repeated bending. In this paper, the frequently used methods for investigating the bending reliability of flexible electronics are presented. This is done to provide an overview of the types of tests that can be performed to investigate the bending reliability. Furthermore, it is shown which devices are developed and optimized to gain more knowledge about the behavior of flexible systems under bending. Both static and dynamic bending test methods are presented.

摘要

柔性电子技术是一种在众多应用领域中迅速发展的技术。可穿戴设备和柔性显示器就是一些应用实例。人们使用各种技术和工艺来生产柔性电子产品。在开发这些系统时需要考虑的一个重要方面是它们的可靠性,特别是在反复弯曲方面。本文介绍了研究柔性电子产品弯曲可靠性的常用方法。这样做是为了概述可用于研究弯曲可靠性的测试类型。此外,还展示了哪些设备得到了开发和优化,以便更深入了解柔性系统在弯曲状态下的行为。文中介绍了静态和动态弯曲测试方法。

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