Cabral Patrícia D, Domingues Telma, Machado George, Chicharo Alexandre, Cerqueira Fátima, Fernandes Elisabete, Athayde Emília, Alpuim Pedro, Borme Jérôme
International Iberian Nanotechnology Laboratory, 4715-330 Braga, Portugal.
Center of Physics, University of Minho, 4710-057 Braga, Portugal.
Materials (Basel). 2020 Dec 15;13(24):5728. doi: 10.3390/ma13245728.
This work is on developing clean-room processes for the fabrication of electrolyte-gate graphene field-effect transistors at the wafer scale for biosensing applications. Our fabrication process overcomes two main issues: removing surface residues after graphene patterning and the dielectric passivation of metallic contacts. A graphene residue-free transfer process is achieved by using a pre-transfer, sacrificial metallic mask that protects the entire wafer except the areas around the channel, source, and drain, onto which the graphene film is transferred and later patterned. After the dissolution of the mask, clean gate electrodes are obtained. The multilayer SiO/SiN dielectric passivation takes advantage of the excellent adhesion of SiO to graphene and the substrate materials and the superior impermeability of SiN. It hinders native nucleation centers and breaks the propagation of defects through the layers, protecting from prolonged exposition to all common solvents found in biochemistry work, contrary to commonly used polymeric passivation. Since wet etch does not allow the required level of control over the lithographic process, a reactive ion etching process using a sacrificial metallic stopping layer is developed and used for patterning the passivation layer. The process achieves devices with high reproducibility at the wafer scale.
这项工作致力于开发用于生物传感应用的晶圆级电解质栅极石墨烯场效应晶体管制造的洁净室工艺。我们的制造工艺克服了两个主要问题:去除石墨烯图案化后的表面残留物以及金属接触的介电钝化。通过使用预转移牺牲金属掩膜实现了无石墨烯残留转移工艺,该掩膜保护整个晶圆,除了沟道、源极和漏极周围的区域,石墨烯膜被转移到这些区域并随后进行图案化。掩膜溶解后,可获得清洁的栅电极。多层SiO/SiN介电钝化利用了SiO对石墨烯和衬底材料的优异附着力以及SiN的卓越抗渗性。它阻碍了本征成核中心并阻断了缺陷在各层中的传播,与常用的聚合物钝化相反,能保护器件免受生物化学工作中常见所有溶剂的长期侵蚀。由于湿法蚀刻无法对光刻工艺实现所需的控制水平,因此开发了一种使用牺牲金属阻挡层的反应离子蚀刻工艺并用于对钝化层进行图案化。该工艺在晶圆级实现了具有高再现性的器件。