Eickenscheidt Max, Langenmair Michael, Dbouk Ahmad, Nötzel Dorit, Hanemann Thomas, Stieglitz Thomas
Laboratory for Biomedical Microtechnology, Department of Microsystems Engineering-IMTEK, University of Freiburg, 79110 Freiburg, Germany.
Institute for Applied Materials, Karlsruhe Institute of Technology, 76344 Karlsruhe, Germany.
Materials (Basel). 2021 Jan 3;14(1):200. doi: 10.3390/ma14010200.
Ceramics are repeatedly investigated as packaging materials because of their gas tightness, e.g., as hermetic implantable housing. Recent advances also make it possible to print the established aluminum oxide in a Fused Filament Fabrication process, creating new possibilities for manufacturing personalized devices with complex shapes. This study was able to achieve integration of channels with a diameter of 500 µm (pre-sintered) with a nozzle size of 250 µm (layer thickness 100 µm) and even closed hemispheres were printed without support structures. During sintering, the weight-bearing feedstock shrinks by 16.7%, resulting in a relative material density of 96.6%. The well-known challenges of the technology such as surface roughness (Ra = 15-20 µm) and integrated cavities remain. However, it could be shown that the hollow structures in bulk do not represent a mechanical weak point and that the material can be gas-tight (<10 mbar s). For verification, a volume-free helium leak test device was developed and validated. Finally, platinum coatings with high adhesion examined the functionalization of the ceramic. All the prerequisites for hermetic housings with integrated metal structures are given, with a new level of complexity of ceramic shapes available.
由于陶瓷具有气密性,例如作为可植入的密封外壳,因此人们反复对其作为包装材料进行研究。最近的进展还使得在熔丝制造工艺中打印成熟的氧化铝成为可能,为制造具有复杂形状的个性化设备创造了新的可能性。本研究能够在喷嘴尺寸为250 µm(层厚100 µm)的情况下实现直径为500 µm(预烧结)的通道集成,甚至在没有支撑结构的情况下打印出封闭的半球体。在烧结过程中,承重原料收缩16.7%,导致相对材料密度为96.6%。该技术面临的诸如表面粗糙度(Ra = 15 - 20 µm)和集成腔体等众所周知的挑战依然存在。然而,可以证明,整体中的中空结构并不代表机械弱点,并且该材料可以是气密的(<10毫巴·秒)。为了进行验证,开发并验证了一种无体积氦泄漏测试装置。最后,具有高附着力的铂涂层对陶瓷的功能化进行了研究。具备集成金属结构的密封外壳的所有先决条件都已具备,陶瓷形状的复杂性达到了一个新的水平。