Department of Orthopedic Surgery, The Second Hospital of Jilin University, Ziqiang Street No. 218, Changchun, 130041, Jilin, People's Republic of China.
Department of Gastroenterology, First Hospital of Jilin University, Jilin University, 71 Xinmin Street, Changchun, 130021, Jilin, People's Republic of China.
Sci Rep. 2021 Jan 11;11(1):457. doi: 10.1038/s41598-020-80269-2.
Electrospun fibrous scaffolds combined with bioactive factors can display impressive performance as an ideal wound dressing, since they can mimic the composition and physicochemical properties of the extracellular matrix (ECM). The aim of this study was to fabricate a new composite biomaterial (IGF1-DA and Os-DA-modified PLGA electrospun fibrous scaffold) for wound healing, using a rat model for experimental evaluation. A small pentapeptide tag composed of DA-Lys-DA-Lys-DA residues was introduced into insulin-like growth factor 1 (IGF1) and the antimicrobial peptide Os to prepare IGF1 and Os modified with 3,4-dihydroxyphenylalanine (DA) (IGF1-DA and Os-DA). The designed chimeric growth factor and antimicrobial peptide could successfully anchor to PLGA electrospun fibrous scaffolds, and the growth factor and antimicrobial peptide could be controllably released from the electrospun fibrous scaffolds. The results showed that the IGF1-DA and Os-DA-modified PLGA electrospun fibrous scaffolds (PLGA/Os-DA/IGF1-DA) exhibited high hydrophilicity and antimicrobial activity; moreover, the porous network of the scaffolds was similar to that of the natural ECM, which can provide a favourable environment for BALB/C 3T3 cells growth. The in vivo application of PLGA/Os-DA/IGF1-DA electrospun fibrous scaffolds in rat skin wounds resulted in improved wound recovery and tissue regeneration rate. The experimental results indicated that the IGF1-DA and Os-DA could effectively bind to PLGA electrospun fibrous scaffolds, promote wound healing and prevent infection in rats, thereby suggesting that PLGA/Os-DA/IGF1-DA electrospun fibrous scaffolds have a wide application value in the field of skin wound repair.
电纺纤维支架与生物活性因子结合可作为理想的伤口敷料,展现出令人印象深刻的性能,因为它们可以模拟细胞外基质(ECM)的组成和理化性质。本研究旨在使用大鼠模型进行实验评估,制备一种新的复合生物材料(IGF1-DA 和 Os-DA 修饰的 PLGA 电纺纤维支架)用于伤口愈合。将由 DA-Lys-DA-Lys-DA 残基组成的小五肽标签引入胰岛素样生长因子 1(IGF1)和抗菌肽 Os 中,制备 3,4-二羟基苯丙氨酸(DA)修饰的 IGF1 和 Os(IGF1-DA 和 Os-DA)。设计的嵌合生长因子和抗菌肽可成功锚定到 PLGA 电纺纤维支架上,并且生长因子和抗菌肽可从电纺纤维支架上可控释放。结果表明,IGF1-DA 和 Os-DA 修饰的 PLGA 电纺纤维支架(PLGA/Os-DA/IGF1-DA)表现出高亲水性和抗菌活性;此外,支架的多孔网络类似于天然 ECM,可为 BALB/C 3T3 细胞的生长提供有利环境。PLGA/Os-DA/IGF1-DA 电纺纤维支架在大鼠皮肤伤口中的体内应用可改善伤口恢复和组织再生率。实验结果表明,IGF1-DA 和 Os-DA 可有效结合到 PLGA 电纺纤维支架上,促进大鼠伤口愈合和预防感染,表明 PLGA/Os-DA/IGF1-DA 电纺纤维支架在皮肤伤口修复领域具有广泛的应用价值。