Behrman Keith, Kymissis Ioannis
Opt Express. 2021 May 10;29(10):14841-14852. doi: 10.1364/OE.425800.
Micro light-emitting diode (microLED) structures were modeled and validated with fabricated devices to investigate p-type GaN (pGaN) contact size dependence on power output efficiency. Two schemes were investigated: a constant 10 μm diameter pGaN contact and varying microLED sizes and a constant 10 μm diameter microLED with varying contact sizes. Modeled devices show a 17% improvement in output power by increasing the microLED die size. Fabricated devices followed the same trend with a 70% improvement in power output. Modeled microLED devices of a constant size and varying inner contact sizes show optimized power output at different current densities for various contact sizes. In particular, lower current densities show optimized output for smaller pGaN contacts and trend towards larger contacts for higher current densities in a balance between undesirable efficiency losses at high-current injection and preventing surface recombination losses. We show that for all device geometries, it is preferential to shrink the pGaN contact to maximize efficiency by suppressing surface recombination losses and further improvements should be carefully considered to optimize efficiency for a desired operational brightness.
对微发光二极管(microLED)结构进行了建模,并与制造的器件进行了验证,以研究p型氮化镓(pGaN)接触尺寸对功率输出效率的依赖性。研究了两种方案:直径恒定为10μm的pGaN接触以及不同尺寸的微发光二极管,和直径恒定为10μm的微发光二极管以及不同的接触尺寸。建模器件显示,通过增加微发光二极管芯片尺寸,输出功率提高了17%。制造的器件呈现相同趋势,功率输出提高了70%。尺寸恒定且内部接触尺寸不同的建模微发光二极管器件显示,对于各种接触尺寸,在不同电流密度下有优化的功率输出。特别是,较低电流密度下较小的pGaN接触显示出优化的输出,而在高电流注入时不希望有的效率损失与防止表面复合损失之间的平衡中,较高电流密度下则倾向于较大的接触。我们表明,对于所有器件几何结构,优先缩小pGaN接触以通过抑制表面复合损失来最大化效率,并且应仔细考虑进一步改进以针对所需的工作亮度优化效率。