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用于制造铂微结构的有机-无机光致抗蚀剂的高分辨率图案化

High Resolution Patterning of an Organic-Inorganic Photoresin for the Fabrication of Platinum Microstructures.

作者信息

Luitz Manuel, Lunzer Markus, Goralczyk Andreas, Mader Markus, Bhagwat Sagar, Warmbold Andreas, Helmer Dorothea, Kotz Frederik, Rapp Bastian E

机构信息

Laboratory of Process Technology, NeptunLab, Department of Microsystems Engineering (IMTEK) University of Freiburg, Georges-Köhler-Allee 103, 79110, Freiburg, Germany.

UpNano GmbH, Modecenterstraße 22/D6, Vienna, 1030, Austria.

出版信息

Adv Mater. 2021 Sep;33(37):e2101992. doi: 10.1002/adma.202101992. Epub 2021 Aug 1.

Abstract

Platinum (Pt) is an interesting material for many applications due to its high chemical resilience, outstanding catalytic activity, high electrical conductivity, and high melting point. However, microstructuring and especially 3D microstructuring of platinum is a complex process, based on expensive and specialized equipment often suffering from very slow processing speeds. In this work, organic-inorganic photoresins, which can be structured using direct optical lithography as well as two-photon lithography (TPL) with submicrometer resolution and high-throughput is presented. The printed structures are subsequently converted to high-purity platinum using thermal debinding of the binder and reduction of the salt. With this technique, complex 3D structures with a 3D resolution of 300 nm were fabricated. At a layer thickness of 35 nm, the patterns reach a high conductivity of 67% compared to bulk platinum. Microheaters, thermocouple sensors as well as a Lab-on-a-Chip system are presented as exemplary applications. This technology will enable a broad range of application from electronics, sensing and heating elements to 3D photonics and metamaterials.

摘要

铂(Pt)因其高化学稳定性、出色的催化活性、高导电性和高熔点,成为许多应用领域中备受关注的材料。然而,铂的微结构化,尤其是三维微结构化是一个复杂的过程,需要依赖昂贵且专业的设备,且加工速度往往非常缓慢。在本研究中,我们展示了一种有机-无机光致抗蚀剂,它可以通过直接光学光刻以及具有亚微米分辨率和高通量的双光子光刻(TPL)进行结构化。随后,通过对粘结剂进行热脱脂和盐还原,将打印的结构转化为高纯度铂。利用该技术,制造出了具有300纳米三维分辨率的复杂三维结构。在35纳米的层厚下,与块状铂相比,图案的电导率高达67%。文中展示了微加热器、热电偶传感器以及芯片实验室系统等典型应用。该技术将为从电子、传感和加热元件到三维光子学和超材料等广泛的应用领域提供支持。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8c5e/11469048/d8643987b962/ADMA-33-2101992-g002.jpg

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