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刺激响应型临时粘合剂:通过策略性分子设计实现按需脱粘

Stimuli-responsive temporary adhesives: enabling debonding on demand through strategic molecular design.

作者信息

Blelloch Nicholas D, Yarbrough Hana J, Mirica Katherine A

机构信息

Burke Laboratory, Department of Chemistry, Dartmouth College Hanover New Hampshire 03755 USA

出版信息

Chem Sci. 2021 Oct 22;12(46):15183-15205. doi: 10.1039/d1sc03426j. eCollection 2021 Dec 1.

Abstract

Stimuli-responsive temporary adhesives constitute a rapidly developing class of materials defined by the modulation of adhesion upon exposure to an external stimulus or stimuli. Engineering these materials to shift between two characteristic properties, strong adhesion and facile debonding, can be achieved through design strategies that target molecular functionalities. This perspective reviews the recent design and development of these materials, with a focus on the different stimuli that may initiate debonding. These stimuli include UV light, thermal energy, chemical triggers, and other potential triggers, such as mechanical force, sublimation, electromagnetism. The conclusion discusses the fundamental value of systematic investigations of the structure-property relationships within these materials and opportunities for unlocking novel functionalities in future versions of adhesives.

摘要

刺激响应型临时粘合剂是一类迅速发展的材料,其定义为在暴露于一种或多种外部刺激时,粘附力会发生调节。通过针对分子功能的设计策略,可以使这些材料在两种特性之间转换,即强粘附力和易于脱粘。本文综述了这些材料的近期设计与开发,重点关注可能引发脱粘的不同刺激因素。这些刺激因素包括紫外线、热能、化学触发剂以及其他潜在触发因素,如机械力、升华、电磁。结论部分讨论了系统研究这些材料内部结构-性能关系的基本价值,以及在未来版本的粘合剂中解锁新功能的机会。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ba65/8635214/449187dda4ab/d1sc03426j-f1.jpg

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