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在铜镍梯度封装体上高通量合成大尺寸单晶六方氮化硼。

A high-throughput synthesis of large-sized single-crystal hexagonal boron nitride on a Cu-Ni gradient enclosure.

作者信息

Zhu Tianyu, Liang Yao, Zhang Chitengfei, Wang Zegao, Dong Mingdong, Wang Chuanbin, Yang Meijun, Goto Takashi, Tu Rong, Zhang Song

机构信息

State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology 122 Luoshi Road Wuhan 430070 People's Republic of China

Interdisciplinary Nanoscience Center (iNANO), Aarhus University DK-8000 Aarhus Denmark.

出版信息

RSC Adv. 2020 Apr 23;10(27):16088-16093. doi: 10.1039/d0ra00734j. eCollection 2020 Apr 21.

Abstract

Large monolayer two-dimensional h-BN can be employed in novel electronic devices because of its thin insulation, excellent thermal stability, and high mechanical strength. However, the efficient synthesis of an h-BN film with large lateral size still faces a great challenge. Here, we report a method for the high-throughput synthesis of large-sized single-crystal h-BN on a Cu-Ni gradient alloy enclosure as the substrate a low-pressure chemical vapor deposition (LPCVD) method. By depositing Ni on the Cu foil in different concentrations to obtain a Cu-Ni in-plane gradient concentration alloy enclosure, the highest growth rate of h-BN was 1 μm min with the lateral size of h-BN being higher than 60 μm. Furthermore, the effect of the Ni content on the single crystal h-BN grain size and nucleation density and the mechanisms for the growth of h-BN were also investigated.

摘要

大面积单层二维六方氮化硼(h-BN)因其绝缘性薄、热稳定性优异和机械强度高,可应用于新型电子器件中。然而,高效合成具有大横向尺寸的h-BN薄膜仍面临巨大挑战。在此,我们报道了一种以Cu-Ni梯度合金外壳为衬底,通过低压化学气相沉积(LPCVD)法高通量合成大尺寸单晶h-BN的方法。通过在铜箔上沉积不同浓度的镍,获得了具有面内梯度浓度的Cu-Ni合金外壳,h-BN的最高生长速率为1μm/min,其横向尺寸大于60μm。此外,还研究了镍含量对单晶h-BN晶粒尺寸和成核密度的影响以及h-BN的生长机制。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/37f7/9052805/f70fd0c449b6/d0ra00734j-f4.jpg

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