Gulsaran Ahmet, Bastug Azer Bersu, Kocer Samed, Rahmanian Sasan, Saritas Resul, Abdel-Rahman Eihab M, Yavuz Mustafa
Mechanical and Mechatronics Engineering Department, University of Waterloo, Waterloo, ON N2L 3G1, Canada.
Waterloo Institute for Nanotechnology (WIN), University of Waterloo, Waterloo, ON N2L 3G1, Canada.
Sensors (Basel). 2022 Jul 14;22(14):5264. doi: 10.3390/s22145264.
An alternative packaging method, termed built-in packaging, is proposed for single terminal devices, and demonstrated with an actuator application. Built-in packaging removes the requirements of wire bonding, chip carrier, PCB, probe station, interconnection elements, and even wires to drive single terminal devices. Reducing these needs simplifies operation and eliminates possible noise sources. A micro resonator device is fabricated and built-in packaged for demonstration with electrostatic actuation and optical measurement. Identical actuation performances are achieved with the most conventional packaging method, wire bonding. The proposed method offers a compact and cheap packaging for industrial and academic applications.
本文提出了一种适用于单端器件的替代封装方法，称为内置封装，并通过一个致动器应用进行了演示。内置封装消除了对引线键合、芯片载体、印刷电路板、探针台、互连元件甚至驱动单端器件的导线的需求。减少这些需求简化了操作并消除了可能的噪声源。制造了一个微谐振器器件并进行了内置封装，以用于静电驱动和光学测量的演示。采用最传统的封装方法——引线键合，也能实现相同的驱动性能。所提出的方法为工业和学术应用提供了一种紧凑且廉价的封装方式。
