Tsiamis Andreas, Buchoux Anthony, Mahon Stephen T, Walton Anthony J, Smith Stewart, Clarke David J, Stokes Adam A
School of Engineering, Institute for Integrated Micro and Nano Systems, The University of Edinburgh, The King's Buildings, Edinburgh EH9 3FF, UK.
School of Engineering, Institute for Multiscale Thermofluids, The University of Edinburgh, The King's Buildings, Edinburgh EH9 3LJ, UK.
Micromachines (Basel). 2023 Feb 25;14(3):537. doi: 10.3390/mi14030537.
The lab-on-a-chip concept, enabled by microfluidic technology, promises the integration of multiple discrete laboratory techniques into a miniaturised system. Research into microfluidics has generally focused on the development of individual elements of the total system (often with relatively limited functionality), without full consideration for integration into a complete fully optimised and miniaturised system. Typically, the operation of many of the reported lab-on-a-chip devices is dependent on the support of a laboratory framework. In this paper, a demonstrator platform for routine laboratory analysis is designed and built, which fully integrates a number of technologies into a single device with multiple domains such as fluidics, electronics, pneumatics, hydraulics, and photonics. This facilitates the delivery of breakthroughs in research, by incorporating all physical requirements into a single device. To highlight this proposed approach, this demonstrator microsystem acts as a fully integrated biochemical assay reaction system. The resulting design determines enzyme kinetics in an automated process and combines reservoirs, three-dimensional fluidic channels, optical sensing, and electronics in a low-cost, low-power and portable package.
由微流控技术实现的芯片实验室概念,有望将多种离散的实验室技术集成到一个小型化系统中。对微流控技术的研究通常集中在整个系统单个元件的开发上(功能往往相对有限),而没有充分考虑将其集成到一个完整的、完全优化的小型化系统中。通常,许多已报道的芯片实验室设备的运行依赖于实验室框架的支持。本文设计并构建了一个用于常规实验室分析的演示平台,该平台将多种技术完全集成到一个具有流体ics、电子、气动、液压和光子学等多个领域的单一设备中。通过将所有物理要求整合到一个设备中,这有助于在研究中取得突破。为了突出这种提议的方法,这个演示微系统充当一个完全集成的生化分析反应系统。最终的设计以自动化过程确定酶动力学,并将储液器、三维流体通道、光学传感和电子元件集成在一个低成本、低功耗且便携的封装中。