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在 CMOS 上集成的数千个电导水平的忆阻器。

Thousands of conductance levels in memristors integrated on CMOS.

机构信息

TetraMem, Fremont, CA, USA.

Department of Electrical and Computer Engineering, University of Massachusetts, Amherst, MA, USA.

出版信息

Nature. 2023 Mar;615(7954):823-829. doi: 10.1038/s41586-023-05759-5. Epub 2023 Mar 29.

DOI:10.1038/s41586-023-05759-5
PMID:36991190
Abstract

Neural networks based on memristive devices have the ability to improve throughput and energy efficiency for machine learning and artificial intelligence, especially in edge applications. Because training a neural network model from scratch is costly in terms of hardware resources, time and energy, it is impractical to do it individually on billions of memristive neural networks distributed at the edge. A practical approach would be to download the synaptic weights obtained from the cloud training and program them directly into memristors for the commercialization of edge applications. Some post-tuning in memristor conductance could be done afterwards or during applications to adapt to specific situations. Therefore, in neural network applications, memristors require high-precision programmability to guarantee uniform and accurate performance across a large number of memristive networks. This requires many distinguishable conductance levels on each memristive device, not only laboratory-made devices but also devices fabricated in factories. Analog memristors with many conductance states also benefit other applications, such as neural network training, scientific computing and even 'mortal computing'. Here we report 2,048 conductance levels achieved with memristors in fully integrated chips with 256 × 256 memristor arrays monolithically integrated on complementary metal-oxide-semiconductor (CMOS) circuits in a commercial foundry. We have identified the underlying physics that previously limited the number of conductance levels that could be achieved in memristors and developed electrical operation protocols to avoid such limitations. These results provide insights into the fundamental understanding of the microscopic picture of memristive switching as well as approaches to enable high-precision memristors for various applications. Fig. 1 HIGH-PRECISION MEMRISTOR FOR NEUROMORPHIC COMPUTING.: a, Proposed scheme of the large-scale application of memristive neural networks for edge computing. Neural network training is performed in the cloud. The obtained weights are downloaded and accurately programmed into a massive number of memristor arrays distributed at the edge, which imposes high-precision requirements on memristive devices. b, An eight-inch wafer with memristors fabricated by a commercial semiconductor manufacturer. c, High-resolution transmission electron microscopy image of the cross-section view of a memristor. Pt and Ta serve as the bottom electrode (BE) and top electrode (TE), respectively. Scale bars, 1 μm and 100 nm (inset). d, Magnification of the memristor material stack. Scale bar, 5 nm. e, As-programmed (blue) and after-denoising (red) currents of a memristor are read by a constant voltage (0.2 V). The denoising process eliminated the large-amplitude RTN observed in the as-programmed state (see Methods). f, Magnification of three nearest-neighbour states after denoising. The current of each state was read by a constant voltage (0.2 V). No large-amplitude RTN was observed, and all of the states can be clearly distinguished. g, An individual memristor on the chip was tuned into 2,048 resistance levels by high-resolution off-chip driving circuitry, and each resistance level was read by a d.c. voltage sweeping from 0 to 0.2 V. The target resistance was set from 50 µS to 4,144 µS with a 2-µS interval between neighbouring levels. All readings at 0.2 V are less than 1 µS from the target conductance. Bottom inset, magnification of the resistance levels. Top inset, experimental results of an entire 256 × 256 array programmed by its 6-bit on-chip circuitry into 64 32 × 32 blocks, and each block is programmed into one of the 64 conductance levels. Each of the 256 × 256 memristors has been previously switched over one million cycles, demonstrating the high endurance and robustness of the devices.

摘要

基于忆阻器的神经网络具有提高机器学习和人工智能的吞吐量和能效的能力,特别是在边缘应用中。由于从头开始训练神经网络模型在硬件资源、时间和能源方面成本高昂,因此在边缘分布式的数十亿个忆阻器神经网络上单独进行训练是不切实际的。一种实际的方法是从云端训练中下载突触权重,并直接将其编程到忆阻器中,以实现边缘应用的商业化。之后或在应用过程中,可以进行一些后调整来适应特定情况。因此,在神经网络应用中,忆阻器需要高精度的可编程性,以确保大量忆阻器网络的均匀和准确性能。这需要每个忆阻器设备具有许多可区分的电导水平,不仅是实验室制造的设备,而且是工厂制造的设备。具有许多电导状态的模拟忆阻器也有益于其他应用,例如神经网络训练、科学计算甚至“凡人计算”。在这里,我们报告了在商业代工厂的互补金属氧化物半导体(CMOS)电路上单片集成的 256×256 忆阻器阵列的完全集成芯片中,通过忆阻器实现的 2048 个电导水平。我们已经确定了以前限制可实现的电导水平的物理机制,并开发了电操作协议来避免这种限制。这些结果为深入了解忆阻器开关的微观图像提供了见解,以及实现各种应用的高精度忆阻器的方法。图 1 用于神经形态计算的高精度忆阻器:a,用于边缘计算的忆阻神经网络大规模应用的建议方案。在云端进行神经网络训练。获得的权重被下载并准确地编程到分布在边缘的大量忆阻器阵列中,这对忆阻器设备提出了高精度要求。b,由商业半导体制造商制造的八英寸晶圆上的忆阻器。c,忆阻器横截面的高分辨率透射电子显微镜图像。Pt 和 Ta 分别用作底电极(BE)和顶电极(TE)。比例尺,1μm 和 100nm(插图)。d,忆阻器材料叠层的放大图。比例尺,5nm。e,通过恒压(0.2V)读取已编程(蓝色)和去噪(红色)后的忆阻器电流。去噪过程消除了在已编程状态下观察到的大振幅 RTN(请参见方法)。f,去噪后的三个最近邻居状态的放大图。每个状态的电流都通过恒压(0.2V)读取。没有观察到大振幅 RTN,并且所有状态都可以清楚地区分。g,通过高分辨率的片外驱动电路将单个芯片上的忆阻器调谐到 2048 个电阻水平,并通过从 0 到 0.2V 的直流电压扫描读取每个电阻水平。目标电阻设置为 50µS 至 4144µS,相邻电平之间的间隔为 2µS。所有在 0.2V 下的读数都与目标电导相差不到 1µS。底部插图,电阻水平的放大图。顶部插图,通过其 6 位片内电路编程为 64 个 32×32 块的整个 256×256 阵列的编程实验结果,每个块编程到 64 个电导水平之一。每个 256×256 的忆阻器都已经经过超过一百万次的开关循环,证明了器件的高耐用性和鲁棒性。

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