Li Hanyang, Yu Miao, Dai Jichun, Zhou Gaoqian, Sun Jiapeng
College of Physics and Optoelectronic Engineering, Harbin Engineering University, Harbin 150001, China.
Nanomaterials (Basel). 2023 May 23;13(11):1704. doi: 10.3390/nano13111704.
As one of the most critical parameters to evaluate the quality and performance of mobile phones, real-time temperature monitoring of mobile phones' integrated chips is vital in the electronics industry. Although several different strategies for the measurement of chips' surface temperature have been proposed in recent years, distributed temperature monitoring with high spatial resolution is still a hot issue with an urgent need to be solved. In this work, a fluorescent film material with photothermal properties containing thermosensitive upconversion nanoparticles (UCNPs) and polydimethylsiloxane (PDMS) is fabricated for the monitoring of the chips' surface temperature. The presented fluorescent films have thicknesses ranging from 23 to 90 μm and are both flexible and elastic. Using the fluorescence intensity ratio (FIR) technique, the temperature-sensing properties of these fluorescent films are investigated. The maximum sensitivity of the fluorescent film was measured to be 1.43% K at 299 K. By testing the temperature at different positions of the optical film, distributed temperature monitoring with a high spatial resolution down to 10 μm on the chip surface was successfully achieved. It is worth mentioning that the film maintained stable performance even under pull stretching up to 100%. The correctness of the method is verified by taking infrared images of the chip surface with an infrared camera. These results demonstrate that the as-prepared optical film is a promising anti-deformation material for monitoring temperature with high spatial resolution on-chip surfaces.
作为评估手机质量和性能的最关键参数之一，手机集成芯片的实时温度监测在电子行业至关重要。尽管近年来已经提出了几种不同的芯片表面温度测量策略，但具有高空间分辨率的分布式温度监测仍然是一个亟待解决的热点问题。在这项工作中，制备了一种具有光热特性的荧光薄膜材料，其包含热敏上转换纳米粒子（UCNPs）和聚二甲基硅氧烷（PDMS），用于监测芯片表面温度。所呈现的荧光薄膜厚度在23至90μm范围内，兼具柔韧性和弹性。利用荧光强度比（FIR）技术，研究了这些荧光薄膜的温度传感特性。在299K下测得荧光薄膜的最大灵敏度为1.43%/K。通过测试光学薄膜不同位置的温度，成功实现了芯片表面低至10μm的高空间分辨率分布式温度监测。值得一提的是，即使在高达100%的拉伸下，该薄膜仍保持稳定性能。通过用红外相机拍摄芯片表面的红外图像，验证了该方法的正确性。这些结果表明，所制备的光学薄膜是一种有前景的抗变形材料，可用于在芯片表面进行高空间分辨率的温度监测。
