Feng Tianren, Yu Duli, Wu Bo, Wang Hui
College of Information Science and Technology, Beijing University of Chemical Technology, Beijing 100029, China.
Guangdong Institute of Semiconductor Micro-Nano Manufacturing Technology, Foshan 528000, China.
Micromachines (Basel). 2023 Jun 9;14(6):1222. doi: 10.3390/mi14061222.
This paper introduces a chip-level oven-controlled system for improving the temperature stability of MEMS resonators wherein we designed the resonator and the micro-hotplate using MEMS technology, then bounding them in a package shell at the chip level. The resonator is transduced by AlN film, and its temperature is monitored by temperature-sensing resistors on both sides. The designed micro-hotplate is placed at the bottom of the resonator chip as a heater and insulated by airgel. The PID pulse width modulation (PWM) circuit controls the heater according to the temperature detection result to provide a constant temperature for the resonator. The proposed oven-controlled MEMS resonator (OCMR) exhibits a frequency drift of 3.5 ppm. Compared with the previously reported similar methods, first, the OCMR structure using airgel combined with a micro-hotplate is proposed for the first time, and the working temperature is extended from 85 °C to 125 °C. Second, our work does not require redesign or additional constraints on the MEMS resonator, so the proposed structure is more general and can be practically applied to other MEMS devices that require temperature control.
本文介绍了一种用于提高MEMS谐振器温度稳定性的芯片级恒温控制系统,其中我们使用MEMS技术设计了谐振器和微热板,然后在芯片级将它们封装在一个封装壳中。谐振器由AlN薄膜进行传感,其温度由两侧的温度敏感电阻进行监测。所设计的微热板作为加热器放置在谐振器芯片底部,并由气凝胶进行隔热。PID脉宽调制(PWM)电路根据温度检测结果控制加热器,为谐振器提供恒定温度。所提出的恒温控制MEMS谐振器(OCMR)的频率漂移为3.5 ppm。与先前报道的类似方法相比,首先,首次提出了使用气凝胶与微热板相结合的OCMR结构,工作温度从85℃扩展到了125℃。其次,我们的工作不需要对MEMS谐振器进行重新设计或额外约束,因此所提出的结构更具通用性,可实际应用于其他需要温度控制的MEMS器件。