Lin Chien-Chun, Lin Chun-Yu
Department of Electrical Engineering, National Taiwan Normal University, Taipei City 106, Taiwan.
Materials (Basel). 2023 Sep 13;16(18):6182. doi: 10.3390/ma16186182.
In prior technology, system-level electrostatic discharge (ESD) tests under environment change conditions mainly focused on testing the effect of a high-temperature environment. i.e., the effect on internal circuits of heat generated outside. However, few studies have explored the effect of ambient relative humidity changes on integrated circuits (ICs). Therefore, this study will analyze the performance of various ESD protection components under high ambient temperature and high ambient relative humidity. The ESD protection devices are tested for the ESD robustness of the silicon-controlled rectifiers (SCR) under a harsh environment and the measurement results are discussed and verified in the CMOS process.
在现有技术中，环境变化条件下的系统级静电放电（ESD）测试主要集中在测试高温环境的影响，即外部产生的热量对内部电路的影响。然而，很少有研究探讨环境相对湿度变化对集成电路（IC）的影响。因此，本研究将分析各种ESD保护组件在高环境温度和高环境相对湿度下的性能。对ESD保护器件在恶劣环境下的可控硅整流器（SCR）的ESD鲁棒性进行测试，并在CMOS工艺中对测量结果进行讨论和验证。
