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激光诱导石墨烯的快速愈合

Flash healing of laser-induced graphene.

作者信息

Cheng Le, Yeung Chi Shun, Huang Libei, Ye Ge, Yan Jie, Li Wanpeng, Yiu Chunki, Chen Fu-Rong, Shen Hanchen, Tang Ben Zhong, Ren Yang, Yu Xinge, Ye Ruquan

机构信息

Department of Chemistry, State Key Laboratory of Marine Pollution, City University of Hong Kong, Hong Kong, 999077, P. R. China.

City University of Hong Kong Research Institute, Shenzhen, Guangdong, 518057, P. R. China.

出版信息

Nat Commun. 2024 Apr 4;15(1):2925. doi: 10.1038/s41467-024-47341-1.

Abstract

The advancement of laser-induced graphene (LIG) technology has streamlined the fabrications of flexible graphene devices. However, the ultrafast kinetics triggered by laser irradiation generates intrinsic amorphous characteristics, leading to high resistivity and compromised performance in electronic devices. Healing graphene defects in specific patterns is technologically challenging by conventional methods. Herein, we report the rapid rectification of LIG's topological defects by flash Joule heating in milliseconds (referred to as F-LIG), whilst preserving its overall structure and porosity. The F-LIG exhibits a decreased I/I ratio from 0.84 - 0.33 and increased crystalline domain from Raman analysis, coupled with a 5-fold surge in conductivity. Pair distribution function and atomic-resolution imaging delineate a broader-range order of F-LIG with a shorter C-C bond of 1.425 Å. The improved crystallinity and conductivity of F-LIG with excellent flexibility enables its utilization in high-performance soft electronics and low-voltage disinfections. Notably, our F-LIG/polydimethylsiloxane strain sensor exhibits a gauge factor of 129.3 within 10% strain, which outperforms pristine LIG by 800%, showcasing significant potential for human-machine interfaces.

摘要

激光诱导石墨烯(LIG)技术的进步简化了柔性石墨烯器件的制造。然而,激光辐照引发的超快动力学产生了固有的非晶特性,导致电子器件中的高电阻率和性能受损。通过传统方法以特定模式修复石墨烯缺陷在技术上具有挑战性。在此,我们报告了通过毫秒级的快速焦耳加热(称为F-LIG)对LIG的拓扑缺陷进行快速修复,同时保留其整体结构和孔隙率。从拉曼分析来看,F-LIG的I/I比从0.84降至0.33,结晶域增加,同时电导率激增5倍。对分布函数和原子分辨率成像描绘了F-LIG具有更广泛的有序结构,其C-C键更短,为1.425 Å。F-LIG具有改善的结晶度和导电性以及出色的柔韧性,使其能够应用于高性能软电子学和低电压消毒。值得注意的是,我们的F-LIG/聚二甲基硅氧烷应变传感器在10%应变范围内的应变系数为129.3,比原始LIG性能高出800%,显示出在人机界面方面的巨大潜力。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1db2/10995154/a7f7e93d48c9/41467_2024_47341_Fig1_HTML.jpg

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